N/A

-

DS3152

Obsolete

表面贴装

144-BGA, CSPBGA

144-TECSBGA (13x13)

Analog Devices Inc./Maxim Integrated

Tray

-40°C ~ 85°C

-

3.135V ~ 3.465V

Line Interface Unit (LIU)

LIU

2

150mA

N/A

-

表面贴装

SG-8101

活跃

Compliant

表面贴装

4-SMD, No Lead

16

16-SOIC

EPSON

Tape & Reel (TR)

-40°C ~ 105°C

Tape & Reel

SG-8101

0.126 L x 0.098 W (3.20mm x 2.50mm)

XO (Standard)

70 °C

0 °C

1.8V ~ 3.3V

126.251 MHz

±20ppm

CMOS

Standby (Power Down)

Crystal

6.8mA (Typ)

5 V

1.1µA

PCM

1

5.5 V

4.5 V

9 mA

16 mA

-

9mA

1

-

0.047 (1.20mm)

无

Contains Lead, Lead Free

-

N/A

-

DS32512

Obsolete

表面贴装

484-BGA

484-BGA (23x23)

Analog Devices Inc./Maxim Integrated

Tray

-40°C ~ 85°C

-

3.135V ~ 3.465V

Line Interface Unit (LIU)

LIU

1

150mA

N/A

-

表面贴装

DS3254

Obsolete

Compliant

表面贴装

144-BGA, CSPBGA

144

144-TECSBGA (13x13)

Analog Devices Inc./Maxim Integrated

Tray

-40°C ~ 85°C

-

85 °C

-40 °C

3.135V ~ 3.465V

Line Interface Unit (LIU)

LIU

4

3.465 V

3.135 V

360 mA

290mA

51.84 Mbps

4

4

无

无铅

N/A

-

CE, CSA, UR

286TTFNA14085

Totally Enclosed Fan Cooled

Obsolete

DS2180A

Tape & Reel (TR)

Round

44-LCC (J-Lead)

44-PLCC (16.59x16.59)

Analog Devices Inc./Maxim Integrated

Marathon Electric

0°C ~ 70°C

-

NEMA Motors, Pump Motors

Cast Iron

4.5V ~ 5.5V

60 Hz

收发器

T1

1

6

3mA

1,170 RPM

Ball

30.84

1.88

3

N/A

-

表面贴装

DIN Rail

Tray

DS26324

Obsolete

Compliant

表面贴装

256-LBGA, CSBGA

256

256-CSBGA (17x17)

Analog Devices Inc./Maxim Integrated

ABB

-40°C ~ 85°C

-

85 °C

-40 °C

3.135V ~ 3.465V

13 A

1.544 MHz

Line Interface Unit (LIU)

3.3 V

LIU

16

3.465 V

3.135 V

500 mA

500mA

环舌

无铅

N/A

-

DS2149

Obsolete

+ 85 C

5.25 V

- 40 C

4.75 V

SMD/SMT

表面贴装

28-LCC (J-Lead)

28-PLCC (11.51x11.51)

Analog Devices Inc./Maxim Integrated

Tube

-40°C ~ 85°C

-

接口集成电路

4.75V ~ 5.25V

Line Interface Unit (LIU)

5 V

1 Channel

LIU

1

-

电信接口集成电路

T1/J1 Line Interface Units - LIUs

N/A

-

DS26524

Obsolete

表面贴装

256-LBGA, CSBGA

256-CSBGA (17x17)

Alloy Steel

Analog Devices Inc./Maxim Integrated

Tray

-

-

3.135V ~ 3.465V

Line Interface Unit (LIU)

LIU

4

260mA

40

N/A

-

表面贴装

Tray

DS3251

Obsolete

表面贴装

144-BGA, CSPBGA

144

144-TECSBGA (13x13)

Analog Devices Inc./Maxim Integrated

Compliant

0°C ~ 70°C

-

70 °C

0 °C

3.135V ~ 3.465V

Line Interface Unit (LIU)

3.3 V

LIU

1

3.465 V

3.135 V

120 mA

80mA

51.84 Mbps

1

1

1

无

无铅

N/A

-

DS3170

Obsolete

表面贴装

100-LBGA, CSBGA

100-CSBGA (11x11)

Analog Devices Inc./Maxim Integrated

Tray

-40°C ~ 85°C

-

3.135V ~ 3.465V

Single-Chip Transceiver

DS3, E3

1

120mA

N/A

-

Transferred

NATIONAL SEMICONDUCTOR CORP

PLASTIC, DIP-20

70 °C

PLASTIC/EPOXY

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5 V

NO

20

无

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

260

1

2.54 mm

not_compliant

40

R-PDIP-T20

不合格

COMMERCIAL

SYNCHRONOUS/ASYNCHRONOUS

10 mA

5.08 mm

PCM 编解码器

YES

A-LAW

1

-5 V

0.15 dB

不提供

26.075 mm

7.62 mm

N/A

-

有

Obsolete

NXP SEMICONDUCTORS

SSOP

4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20

85 °C

-40 °C

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

3 V

YES

20

KGM

1210

3225

MLCC

SMD

ceramic

±5%

8542.39.00.01

4.7nF

DUAL

鸥翼

260

1

0.65 mm

compliant

40

20

R-PDSO-G20

不合格

C0G (NP0)

INDUSTRIAL

1.5 mm

电信电路

6.5 mm

4.4 mm

N/A

-

Transferred

MICREL INC

19 X 19 MM, LEAD FREE, PLASTIC, MO-151, BGA-289

70 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.8 V

YES

289

有

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

BOTTOM

BALL

250

1

1 mm

compliant

40

S-PBGA-B289

不合格

COMMERCIAL

2.26 mm

电信电路

3

19 mm

19 mm

N/A

-

AVAGO TECHNOLOGIES INC

HVBCC,

UNSPECIFIED

HVBCC

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

YES

28

Obsolete

8542.39.00.01

BOTTOM

BUTT

1

0.5 mm

unknown

S-XBCC-B28

0.91 mm

电信电路

5 mm

5 mm

N/A

-

4.22 +0.08 mm

活跃

INFINEON TECHNOLOGIES AG

WLBGA-42

85 °C

-30 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.22 V

YES

Galvanized steel

42

t = 0.98 mm

M3

0.5

BOTTOM

BALL

1

0.4 mm

compliant

R-PBGA-B42

OTHER

0.6 mm

电信电路

L = 1.5 ±0.25 mm

3.019 mm

2.509 mm

N/A

-

IP67

有

接触制造商

ESPRESSIF SYSTEMS (SHANGHAI) PTE LTD

PACKAGE-38

85 °C

-40 °C

UNSPECIFIED

DMA

RECTANGULAR

微电子组件

3.3 V

YES

housing - stainless steel; gasket - silicone rubber

38

at least 1 L/min at 70 mbar pressure

electric, lighting, photoelectric, security, automotive and other equipment

KGM

0805

2012

MLCC

for pressure equalization in sealed enclosures and protection against condensation formation

SMD

ceramic

±1%

5A992.C

M5X0.8 pressure equalization valve, metal

to hydrostatic pressure - at least 100 mbar for 30 min

8542.39.00.01

2.2nF

DUAL

无铅

250

1

1.27 mm

compliant

R-XDMA-N38

C0G (NP0)

INDUSTRIAL

150000 Mbps

3.45 mm

电信电路

3

31.4 mm

18 mm

N/A

-

Obsolete

MICROSEMI CORP

LCC

PLASTIC, MS-018AB, LCC-28

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5 V

YES

28

无

e0

无

锡铅

8542.39.00.01

QUAD

J BEND

1

1.27 mm

unknown

28

S-PQCC-J28

不合格

INDUSTRIAL

4.57 mm

电信电路

11.505 mm

11.505 mm

N/A

-

MX COM INC

SOIC

,

PLASTIC/EPOXY

RECTANGULAR

小概要

YES

24

Obsolete

8542.39.00.01

DUAL

鸥翼

unknown

24

R-PDSO-G24

不合格

MODEM

N/A

-

Obsolete

CML MICROCIRCUITS LTD

SOIC

SOP, SOP24,.4

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP24,.4

RECTANGULAR

小概要

3 V

YES

24

有

e3

有

Matte Tin (Sn)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

compliant

40

24

R-PDSO-G24

不合格

INDUSTRIAL

0.011 mA

1 Mbps

2.67 mm

MODEM

15.365 mm

7.425 mm

N/A

-

Transferred

MICREL INC

QFN-32

70 °C

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.3 V

YES

Plastic / metal

32

有

e4

镍钯金

Orange

QUAD

无铅

260

1

0.5 mm

compliant

40

S-XQCC-N32

不合格

COMMERCIAL

100000 Mbps

1 mm

以太网收发器

1

2

19.7 mm

5 mm

5 mm

N/A

-

RF MICRO DEVICES INC

HVQCCN,

105 °C

-40 °C

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5 V

SMD

YES

16

KGM

0201

0603

MLCC

Transferred

ceramic

8542.39.00.01

4.7pF

QUAD

无铅

1

0.5 mm

unknown

S-XQCC-N16

C0G (NP0)

INDUSTRIAL

0.9 mm

电信电路

3 mm

3 mm

N/A

-

活跃

XILINX INC

BGA

,

PLASTIC/EPOXY

SQUARE

网格排列

SMD

YES

552

GCQ

0201

0603

MLCC

有

ceramic

e2

铜镀锡银

8.4pF

BOTTOM

BALL

未说明

compliant

未说明

552

S-PBGA-B552

不合格

C0G (NP0)

电信电路

N/A

-

Transferred

MICREL INC

LEAD FREE, PLASTIC, QFP-128

70 °C

PLASTIC/EPOXY

FQFP

QFP128,.68X.91,20

RECTANGULAR

FLATPACK, FINE PITCH

1.8 V

SMD

YES

128

GCM

0402

1005

MLCC

有

ceramic

e3

Matte Tin (Sn)

0.75pF

QUAD

鸥翼

260

1

0.5 mm

compliant

40

R-PQFP-G128

不合格

C0G (NP0)

COMMERCIAL

375 mA

3.4 mm

ETHERNET SWITCH

3

20 mm

14 mm

N/A

-

接触制造商

SANKOSHA CORP

,

UNSPECIFIED

ROUND

特殊形状

NO

2

GCQ

0201

0603

MLCC

SMD

ceramic

±2%

10pF

UNSPECIFIED

WIRE

1

unknown

O-XXSS-W2

C0G (NP0)

浪涌保护电路

N/A

-

Obsolete

CML MICROCIRCUITS LTD

SSOP, SOP24,.4

85 °C

-40 °C

PLASTIC/EPOXY

SSOP

SOP24,.4

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

YES

24

GCQ

0201

0603

MLCC

SMD

ceramic

8542.39.00.01

1.3pF

DUAL

鸥翼

1

0.65 mm

compliant

R-PDSO-G24

不合格

C0G (NP0)

INDUSTRIAL

0.01 mA

1.99 mm

MODEM-SUPPORT CIRCUIT

8.2 mm

5.29 mm