类别是'陶瓷电容器'
陶瓷电容器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 端子形状 | 越来越多的功能 | 引脚数 | 材料 | 介电材料 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 温度系数 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 应用 | HTS代码 | 电容量 | 子类别 | 电压 - 额定直流 | 包装方式 | 端子间距 | 深度 | 结构 | Reach合规守则 | 频率 | 终端样式 | 箱码(公制) | 箱码(英制) | 螺纹距离 | 电容式 | 电介质 | 失败率 | 引线间距 | 温度特性代码 | 多层 | 绝缘电阻 | 额定(DC)电压(URdc) | 铅直径 | 尺寸代码 | 阻抗 | 引线样式 | 耗散因数 | 正容差 | 负公差 | 引线/基座样式 | 无卤素 | 产品类别 | 工作温度范围 | 频率范围 | 射频/微波器件类型 | 插入损耗 | 工作频率-最小值 | 电压驻波比 - 最大值 | 输入功率-最大(CW) | 特性阻抗 | 产品 | 特征 | 产品类别 | 产品长度 | 产品宽度 | 直径 | 高度 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | 评级结果 | |||||||||||||||||||||||||||||||||||||
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![]() | C322C473J5R5TA7301 | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 50 VDC | 符合层覆 | - 55 C | + 125 C | 47 nF | 47000 pF | Class 2 | 2.5 % | 2500 | X7R | GoldMax | Tape & Reel (TR) | 活跃 | KEMET | Details | MouseReel | GoldMax 300 Comm X7R | 5 % | Goldmax X7R Dielectric Commercial Grade MLCCs | 0.047 uF | Radial | X7R | 5.08 mm | 0.51 mm | 外弯曲 | 通用型MLCC | 5.08 mm | 5.08(Max) x 3.18(Max) x 6.6(Max) | 3.18 mm | 5.08 mm | 6.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C114C151G2G5CA | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 200 VDC | Molded | - 55 C | + 125 C | 0.15 nF | Class 1 | 0.1 % | C0G (NP0) | 200 | Bulk | 活跃 | KEMET | N | Bulk | LDD Comm C0G | 2 % | 商用级MLCC | 150 pF | Axial | C0G (NP0) | 0.51 mm | Straight | - 55 C to + 125 C | 通用型MLCC | 2.29 mm | 4.06 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C330C123K2G5TA | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 200 VDC | 符合层覆 | - 55 C | + 125 C | 12 nF | 12000 pF | Class 1 | 0.1 % | 250 | C0G (NP0) | GoldMax | 200 VDC | Bulk | 活跃 | 200 V | KEMET | Details | Bulk | GoldMax 300 Comm C0G | 10 % | Radial | Goldmax C0G Dielectric Commercial Grade MLCCs | 125 °C | -55 °C | 0.012 uF | Radial | 5.08 mm | C0G (NP0) | 5.08 mm | 0.51 mm | 外弯曲 | 0.1 % | - 55 C to + 125 C | 通用型MLCC | 4.07 mm | 7.11 mm | 9.14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C1206C474K4RAC3124 | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 VDC | 1206 | 3216 | - 55 C | + 125 C | AEC-Q200 | 470 nF | 470000 pF | Class 2 | 10000 | 0.000952 oz | 16 V | 16 V | 1206 (3216 metric) | Details | MouseReel | SMD Comm X7R | 10 % | Standard | X7R Dielectric Commercial Grade MLCCs | 125 °C | -55 °C | 0.47 uF | SMD/SMT | 3216 | 1206 | X7R | 5 % | 通用型MLCC | 0.9 mm | 3.2 mm | 1.6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C315C820J1G5HA7303 | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 100 VDC | 符合层覆 | - 55 C | + 125 C | Class 1 | 0.1 % | 2500 | C0G (NP0) | GoldMax | 100 VDC | 100 V | N | 切割胶带 | GoldMax 300 Comm C0G | 0.25 pF | Radial | Goldmax C0G Dielectric Commercial Grade MLCCs | 125 °C | -55 °C | 82 pF | Radial | 2.54 mm | C0G (NP0) | 2.54 mm | 0.51 mm | Straight | 0.1 % | - 55 C to + 125 C | 通用型MLCC | 2.54 mm | 3.81 mm | 3.14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CBR04C360J5GACAUTO | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 50V | AEC-Q200 | 0402 | 1005 | + 125 C | - 55 C | 10000 | KEMET | 50 VDC | KEMET | Details | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Surface Mount, MLCC | 0402 (1005 Metric) | KEMET | 活跃 | -55°C ~ 125°C | MouseReel | CBR-SMD RF Auto C0G | 0.039" L x 0.020" W (1.00mm x 0.50mm) | ±5% | Standard | C0G, NP0 | 汽车用MLCC | Automotive, Boardflex Sensitive | 36 pF | Capacitors | SMD/SMT | C0G (NP0) | - | - | - | RF Microwave / High Q | High Q, Low Loss, Ultra Low ESR | 陶瓷电容器 | 0.5 mm | - | 1 mm | 0.5 mm | 0.022" (0.55mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CC1206KRX7R9BB271 | Yageo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 33 Weeks | 表面贴装 | Surface Mount, MLCC | 1206 (3216 Metric) | WRAPAROUND | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2010 | CC | 0.126Lx0.063W 3.20mmx1.60mm | ±10% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X7R | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 8532.24.00.20 | 270pF | 50V | TR, PAPER, 7 INCH | 1.6mm | 3216 | 1206 | X7R | 有 | 10GOhm | 2.5 % | 无卤素 | 1.45mm | 0.033 0.85mm | 838.2μm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CKG45KX7R2J104M290JH | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | Surface Mount, MLCC | 非标准 SMD | J BEND | 2 | -55°C~125°C | Tape & Reel (TR) | 2012 | MEGACAP, CKG | 0.197Lx0.138W 5.00mmx3.50mm | ±20% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | Metal | EAR99 | X7R | Matte Tin (Sn) - with Nickel (Ni) barrier | Ceramic | SMPS Filtering, Bypass, Decoupling | 0.1μF | 630V | TR, 13 Inch | 3.5mm | 4532 | 1812 | X7R | 有 | 低ESL | 2.9mm | 0.118 3.00mm | 2.9972mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C1608X7R2A102M080AA | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | Surface Mount, MLCC | 0603 (1608 Metric) | WRAPAROUND | 2 | 2.012816mg | -55°C~125°C | Tape & Reel (TR) | 2011 | C | 0.063Lx0.031W 1.60mmx0.80mm | ±20% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X7R | Ceramic | 通用型 | 1000pF | 100V | 800μm | 1608 | 0603 | X7R | 有 | 800μm | 1.6mm | 0.8mm | 0.035 0.90mm | 939.8μm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C5750X7R1H685M250KA | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago) | 表面贴装 | Surface Mount, MLCC | 2220 (5750 Metric) | WRAPAROUND | 2 | Ceramic | 480.014126mg | -55°C~125°C | Tape & Reel (TR) | 2010 | C | 0.224Lx0.197W 5.70mmx5.00mm | ±20% | e3 | yes | 不用于新设计 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X7R | 通用型 | 6.8μF | 50V | 5mm | 5750 | 2220 | X7R | 有 | 低ESL | 5.7mm | 0.110 2.80mm | 2.794mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C3216X7R2J153M130AA | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago) | 表面贴装 | Surface Mount, MLCC | 1206 (3216 Metric) | WRAPAROUND | 2 | 16.187578mg | -55°C~125°C | Tape & Reel (TR) | 2011 | C | 0.126Lx0.063W 3.20mmx1.60mm | ±20% | e3 | yes | 不用于新设计 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X7R | Ceramic | 通用型 | 0.015μF | 630V | 1.6mm | 3216 | 1206 | X7R | 有 | 1.6mm | 0.055 1.40mm | 1.397mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CD12ZU2GA472MYGKA | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago) | 通孔 | 通孔 | Radial, Disc | 440VAC | -25°C~125°C | Bulk | 2001 | CD | 0.531Dia 13.50mm | ±20% | Obsolete | 不适用 | Radial | Z5U | 125°C | -25°C | Safety | 4700pF | 10.0076mm | Z5U | 0.394 10.00mm | Formed Leads - Kinked | Straight | 高电压 | 0.689 17.50mm | 符合RoHS标准 | X1, Y1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CC0402KRX7R7BB333 | Yageo | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 33 Weeks | 表面贴装 | Surface Mount, MLCC | 0402 (1005 Metric) | WRAPAROUND | 2 | Ceramic | -55°C~125°C | Tape & Reel (TR) | 2010 | CC | 0.039Lx0.020W 1.00mmx0.50mm | ±10% | e3 | yes | 活跃 | 1 (Unlimited) | 2 | SMD/SMT | EAR99 | X7R | Matte Tin (Sn) - with Nickel (Ni) barrier | 通用型 | 0.033μF | 16V | TR, PAPER, 7 INCH | 500μm | 1005 | 0402 | X7R | 有 | 无卤素 | 550μm | 1mm | 0.5mm | 0.022 0.55mm | 558.8μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT15N1R5B500CT | Walsin Technology Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 活跃 | 50V | 0402 | 1005 | + 125 C | 0.000053 oz | - 55 C | 10000 | Walsin | 50 VDC | Walsin | Details | Class 1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT | Surface Mount, MLCC | 0402 (1005 Metric) | Walsin Technology Corporation | Tape & Reel (TR) | -55°C ~ 125°C | MouseReel | MT | 0.039" L x 0.020" W (1.00mm x 0.50mm) | ±0.1pF | Standard | C0G, NP0 | 高电容MLCC | 汽车 | 1.5 pF | Capacitors | SMD/SMT | C0G (NP0) | - | - | - | 汽车用MLCC | - | 陶瓷电容器 | 0.5 mm | - | 1 mm | 0.5 mm | 0.022" (0.55mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C317C101MDR5TA | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 1 kVDC | 符合层覆 | - 55 C | + 125 C | 0.1 nF | Class 2 | 2.5 % | 500 | X7R | GoldMax | Bulk | 活跃 | , 1515 | Radial | -55 °C | 125 °C | 有 | C317C101MDR5TA | 矩形包装 | 活跃 | KEMET ELECTRONICS CORP | 5.67 | NO | WIRE | 通孔安装 | CERAMIC | 2 | KEMET | Details | Bulk | GoldMax 300 Comm X7R HV | 20 % | e3 | 有 | EAR99 | 15% ppm/°C | High Voltage Goldmax X7R Dielectric Commercial Grade MLCCs | Matte Tin (Sn) - with Nickel (Ni) barrier | 8532.24.00.60 | 100 pF | BULK | 5.08 mm | compliant | Radial | 陶瓷电容器 | X7R | 5.08 mm | X7R | 有 | 1000 V | 0.51 mm | 1515 | 外弯曲 | 20% | 20% | 高压MLCC | 3.14 mm | 3.81 mm | 5.08 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C330C473K1R5HA | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 100 VDC | 符合层覆 | - 55 C | + 125 C | 47 nF | 47000 pF | Class 2 | 2.5 % | 250 | X7R | GoldMax | Bulk | 活跃 | KEMET | N | Bulk | GoldMax 300 Comm X7R | 10 % | Goldmax X7R Dielectric Commercial Grade MLCCs | 0.047 uF | Radial | X7R | 5.08 mm | 0.51 mm | 外弯曲 | 通用型MLCC | 4.07 mm | 7.11 mm | 9.14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BDCA-16-30+ | Mini-Circuits | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | - 55 C | + 100 C | PCB 安装 | 1000 | ROHS COMPLIANT, HERMETIC SEALED, CASE DZ944, 10 PIN | -55 °C | 100 °C | 有 | 4200 MHz | BDCA-16-30+ | 1.2 dB | 活跃 | MINI-CIRCUITS | 5.39 | 3025 (7664 metric) | Details | MouseReel | BDCA | e3 | 有 | EAR99 | High-Power Bi-Directional Coupler | Tin (Sn) | COMPONENT | compliant | 4.2 GHz | SMD/SMT | 50 Ohms | 1800 MHz to 4200 MHz | BI-DIRECTIONAL COUPLER | 0.7 dB | 1800 MHz | 1.3 | 42.55 dBm | 50 Ω | Couplers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CBR08C659D5GAC | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 50 VDC | 0805 | 2012 | - 55 C | + 125 C | Class 1 | 4000 | 0.000194 oz | Tape & Reel (TR) | 活跃 | 50 V | 50 V | , 0805 | SMT | -55 °C | 125 °C | 有 | CBR08C659D5GAC | 活跃 | KEMET ELECTRONICS CORP | 5.72 | 0805 (2012 metric) | YES | WRAPAROUND | SURFACE MOUNT | Ceramic | CERAMIC | 5.499807 mg | 2 | KEMET | Details | MouseReel | CBR | 0.5 pF | e3 | 有 | Standard | EAR99 | 30 ppm/°C | 表面贴装多层陶瓷电容器 | Matte Tin (Sn) - with Nickel (Ni) barrier | 125 °C | -55 °C | 6.5 pF | TR, Punched Paper, 7 Inch | compliant | SMD/SMT | 2012 | 0805 | 陶瓷电容器 | C0G (NP0) | C0G | 有 | 50 V | 0805 | 7.6923% | 7.6923% | RF Microwave / High Q | 0.85 mm | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CBR08C619D5GAC | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 50 VDC | 0805 | 2012 | - 55 C | + 125 C | Class 1 | 4000 | 0.000194 oz | 50 V | 50 V | Tape & Reel (TR) | 活跃 | , 0805 | SMT | -55 °C | 125 °C | 有 | CBR08C619D5GAC | 活跃 | KEMET ELECTRONICS CORP | 5.72 | 0805 (2012 metric) | YES | WRAPAROUND | SURFACE MOUNT | Ceramic | CERAMIC | 5.499807 mg | 2 | KEMET | Details | MouseReel | CBR | 0.5 pF | e3 | 有 | Standard | EAR99 | 30 ppm/°C | 表面贴装多层陶瓷电容器 | Matte Tin (Sn) - with Nickel (Ni) barrier | 125 °C | -55 °C | 6.1 pF | TR, Punched Paper, 7 Inch | compliant | SMD/SMT | 2012 | 0805 | 陶瓷电容器 | C0G (NP0) | C0G | 有 | 50 V | 0805 | 8.1967% | 8.1967% | RF Microwave / High Q | 0.85 mm | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C322C333K5R5HA7301 | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 50 VDC | 符合层覆 | - 55 C | + 125 C | 33 nF | 33000 pF | Class 2 | 2.5 % | 2500 | X7R | GoldMax | 50 VDC | N | 切割胶带 | GoldMax 300 Comm X7R | 10 % | Radial | Goldmax X7R Dielectric Commercial Grade MLCCs | 125 °C | -55 °C | 0.033 uF | Radial | 5.08 mm | X7R | 5.08 mm | 0.51 mm | 外弯曲 | 2.5 % | - 55 C to + 125 C | 通用型MLCC | 3.18 mm | 5.08 mm | 6.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C317C472M5R5HA | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 50 VDC | 符合层覆 | - 55 C | + 125 C | 4.7 nF | 0.0047 uF | Class 2 | 2.5 % | 500 | C0G (NP0) | GoldMax | 50 VDC | Bulk | 活跃 | 径向引线 | Radial | -55 °C | 125 °C | 无 | C317C472M5R5HA | 矩形包装 | 活跃 | KEMET ELECTRONICS CORP | 5.49 | NO | WIRE | 通孔安装 | CERAMIC | 2 | KEMET | N | Bulk | GoldMax 300 Comm X7R | 20 % | e0 | 无 | EAR99 | 15% ppm/°C | Goldmax X7R Dielectric Commercial Grade MLCCs | Tin/Lead (Sn60Pb40) | 8532.24.00.60 | 4700 pF | Bulk | 5.08 mm | not_compliant | Radial | 陶瓷电容器 | X7R | 5.08 mm | X7R | 有 | 50 V | 0.51 mm | 外弯曲 | 20% | 20% | - 55 C to + 125 C | 通用型MLCC | 2.54 mm | 3.81 mm | 5.08 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CBR08C739D5GAC | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 50 VDC | 0805 | 2012 | - 55 C | + 125 C | Class 1 | 4000 | 0.000194 oz | Tape & Reel (TR) | 活跃 | , 0805 | SMT | -55 °C | 125 °C | 有 | CBR08C739D5GAC | 活跃 | KEMET ELECTRONICS CORP | 5.72 | 0805 (2012 metric) | YES | WRAPAROUND | SURFACE MOUNT | CERAMIC | 2 | KEMET | Details | MouseReel | CBR | 0.5 pF | e3 | 有 | Standard | EAR99 | -/+30ppm/Cel ppm/°C | 表面贴装多层陶瓷电容器 | Matte Tin (Sn) - with Nickel (Ni) barrier | 7.3 pF | TR, Punched Paper, 7 Inch | compliant | SMD/SMT | 陶瓷电容器 | C0G (NP0) | C0G | 有 | 50 V | 0805 | 6.8493% | 6.8493% | RF Microwave / High Q | 0.85 mm | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CBR08C959D5GAC | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 24 Weeks | 50 VDC | 0805 | 2012 | - 55 C | + 125 C | Class 1 | 4000 | 0.000194 oz | Tape & Reel (TR) | 活跃 | , 0805 | SMT | -55 °C | 125 °C | 有 | CBR08C959D5GAC | 活跃 | KEMET ELECTRONICS CORP | 5.72 | 0805 (2012 metric) | YES | WRAPAROUND | SURFACE MOUNT | CERAMIC | 2 | KEMET | Details | MouseReel | CBR | 0.5 pF | e3 | 有 | Standard | EAR99 | -/+30ppm/Cel ppm/°C | 表面贴装多层陶瓷电容器 | Matte Tin (Sn) - with Nickel (Ni) barrier | 9.5 pF | TR, Punched Paper, 7 Inch | compliant | SMD/SMT | 陶瓷电容器 | C0G (NP0) | C0G | 有 | 50 V | 0805 | 5.2632% | 5.2632% | RF Microwave / High Q | 0.85 mm | 2 mm | 1.25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C328C272G1G5TA | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 100 VDC | 符合层覆 | - 55 C | + 125 C | 2.7 nF | 0.0027 uF | Class 1 | 0.1 % | 500 | C0G (NP0) | GoldMax | Bulk | 活跃 | , 2012 | Radial | -55 °C | 125 °C | 有 | C328C272G1G5TA | 矩形包装 | 活跃 | KEMET ELECTRONICS CORP | 5.67 | NO | WIRE | 通孔安装 | CERAMIC | 2 | KEMET | Details | Bulk | GoldMax 300 Comm C0G | 2 % | e3 | 有 | EAR99 | -/+30ppm/Cel ppm/°C | Goldmax C0G Dielectric Commercial Grade MLCCs | Matte Tin (Sn) - with Nickel (Ni) barrier | 8532.24.00.60 | 2700 pF | BULK | 5.08 mm | compliant | Radial | 陶瓷电容器 | C0G (NP0) | 5.08 mm | C0G | 有 | 100 V | 0.51 mm | 2012 | 外弯曲 | 2% | 2% | 通用型MLCC | 3.18 mm | 5.08 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | C315C200F1G5TA | KEMET | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | Class 1 | + 125 C | - 55 C | 符合层覆 | 100 VDC | Details | 500 | C0G (NP0) | GoldMax | Bulk | 活跃 | , | -55 °C | 125 °C | 有 | C315C200F1G5TA | 矩形包装 | 活跃 | KEMET ELECTRONICS CORP | 5.43 | NO | WIRE | 通孔安装 | CERAMIC | 2 | KEMET | 0.1 % | Bulk | GoldMax 300 Comm C0G | 1 % | e3 | 有 | EAR99 | -/+30ppm/Cel ppm/°C | Goldmax C0G Dielectric Commercial Grade MLCCs | Matte Tin (Sn) - with Nickel (Ni) barrier | 8532.24.00.60 | 20 pF | BULK | compliant | Radial | 陶瓷电容器 | C0G (NP0) | 2.54 mm | C0G | 有 | 100 V | 0.51 mm | Straight | 1% | 1% | - 55 C to + 125 C | 通用型MLCC | 2.54 mm | 3.81 mm | 3.14 mm |