类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 类型 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 工作电源电压 | 电源 | 通道数量 | 界面 | 内存大小 | 内存大小 | 数据总线宽度 | 议定书 | 核心架构 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 消费者集成电路类型 | 敏感度 | 数据率（最大） | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 通用输入输出数量 | [医]GPIO | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
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 | BC63B239A05-AQK-E4 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 40-UFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | BlueCore® | 不用于新设计 | 3 (168 Hours) | TxRx + MCU | 2.7V~5.5V | 2.4GHz | 4MB ROM 48kB RAM | Bluetooth v2.1 +EDR, Class 1 | 8dBm | Bluetooth | 3Mbps | -90 dBm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | NRF2401AG-REEL7 | Nordic Semiconductor ASA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 20 Weeks | 表面贴装 | 24-VQFN Exposed Pad | 24 | 24-QFN (5x5) | -40°C~85°C | Tape & Reel (TR) | 2004 | 活跃 | 3 (168 Hours) | 仅TxRx | 85°C | -40°C | 1.9V~3.6V | 2.4GHz | 3.6V | SPI | 0dBm | General ISM > 1GHZ | -93dBm | 1Mbps | SPI | 18mA~25mA | 8.8mA~13mA | GFSK | -93 dBm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | EFR32BG1V132F256GJ43-C0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 43-UFBGA, CSPBGA | YES | -40°C~85°C | Strip | 2016 | yes | Obsolete | 1 (Unlimited) | 43 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | BOTTOM | BALL | 1 | 3.3V | 0.4mm | 2.4GHz | R-PBGA-B43 | 256kB Flash 16kB RAM | Bluetooth v4.0 | 19.5dBm | Bluetooth | -99dBm | 2Mbps | I2C, SPI, UART | 8.7mA | 8.2mA | 2-FSK, 4-FSK, DSSS, GFSK, GMSK, O-QPSK | 19 | 0.54mm | 3.295mm | 3.143mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | EFR32FG1P131F128GM32-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 柔性壁虎 | yes | 活跃 | 2 (1 Year) | 32 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | compliant | 169MHz~915MHz | S-XQCC-N32 | 128kB Flash 32kB RAM | 柔性壁虎 | 20dBm | 802.15.4 | -94dBm | 1Mbps | I2C, I2S, SPI, UART, USART | 8.7mA | 8.2mA | 2FSK, 4FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 16 | 0.9mm | 5mm | 5mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | BC0401PC08-IXB-R | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 47-WFBGA, WLCSP | 47 | -40°C~105°C | Tape & Reel (TR) | BlueCore® | Obsolete | 3 (168 Hours) | TxRx + MCU | 2.2V~4.2V | 2.4GHz | 4MB ROM | Bluetooth v2.1 +EDR, Class 2 and 3 | 6dBm | Bluetooth | 3Mbps | -86 dBm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | EM3597-RT | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 56-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2014 | 活跃 | 2 (1 Year) | 56 | TxRx + MCU | 8542.31.00.01 | 2.1V~3.6V | QUAD | 无铅 | 1.25V | 0.5mm | 2.4GHz | S-XQCC-N56 | I2C, SPI, UART | 512kB Flash 64kB RAM | Zigbee® | 8dBm | 802.15.4 | 5Mbps | I2C, JTAG, SPI, UART | 23.5mA~29.5mA | 24mA~44mA | O-QPSK | -102 dBm | 32 | 0.9mm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | EFR32MG1P232F256IM48-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2017 | Mighty Gecko | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 256kB Flash 32kB RAM | Bluetooth v4.0, Thread, Zigbee® | 19dBm | 802.15.4, Bluetooth | 2Mbps | I2C, I2S, SPI, UART | 8.2mA~126.7mA | 31 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
 | EFR32MG14P632F256GM32-B | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | Tray | 活跃 | 2 (1 Year) | compliant | 电信电路 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EFR32MG12P433F1024GL125-C | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 125-VFBGA | Tray | 2018 | Mighty Gecko | 活跃 | 3 (168 Hours) | TxRx + MCU | compliant | 1MB Flash 256kB RAM | Bluetooth v4.0, Thread, Zigbee® | 802.15.4, Bluetooth | I2C, I2S, SPI, UART | 65 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| EFR32FG14P232F128GM32-B | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | -40°C~85°C | Tray | 柔性壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 2.4GHz | 128kB Flash 16kB RAM | 柔性壁虎 | 19dBm | 802.15.4 | -126.2dBm | 1Mbps | I2C, I2S, SPI, UART, USART | 8.4mA~10.2mA | 8.5mA~35.3mA | 2FSK, 4FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 16 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| EFR32FG12P231F1024GL125-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 125-VFBGA | -40°C~85°C | Tape & Reel (TR) | 柔性壁虎 | yes | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.8V~3.8V | compliant | 169MHz 315MHz 433MHz 490MHz 868MHz 915MHz | 1024kB Flash 128kB RAM | 20dBm | -102dBm | 2Mbps | I2C, I2S, SPI, UART | 8mA~10.8mA | 8.2mA~126.7mA | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 65 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
 | BC63B239A04-IYB-E4 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 51-WLCSP | 51 | Tape & Reel (TR) | BlueCore® | Obsolete | 3 (168 Hours) | TxRx + MCU | 2.7V~5.5V | 2.4GHz | 6MB ROM 48kB RAM | Bluetooth v2.1 +EDR, Class 2 and 3 | 7dbm | Bluetooth | 3Mbps | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | CYW20730A1KMLG | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 40-VFQFN Exposed Pad | YES | 0°C~70°C | Tray | 2016 | 活跃 | 3 (168 Hours) | 40 | TxRx + MCU | 1.2V | QUAD | 无铅 | 1 | 1.2V | 0.5mm | 2.4GHz | Bluetooth v3.0 | 4dBm | Bluetooth | -88dBm | 1Mbps | I2C, SPI, UART | 26.6mA | 19mA~24mA | GFSK | 4 | 1mm | 6mm | 6mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
| EFR32FG1V131F64GM32-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 柔性壁虎 | yes | 活跃 | 2 (1 Year) | 32 | TxRx + MCU | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | compliant | 169MHz~915MHz | S-XQCC-N32 | 64kB Flash 16kB RAM | 柔性壁虎 | 16.5dBm | 802.15.4 | -94dBm | 1Mbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA | 2FSK, 4FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, MSK, OOK, O-QPSK | 16 | 0.9mm | 5mm | 5mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | CC8520RHAT | NA | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | ACTIVE (Last Updated: 3 days ago) | Gold | 表面贴装 | 表面贴装 | 40-VFQFN Exposed Pad | 40 | -40°C~85°C | Tape & Reel (TR) | PurePath™ Wireless | e4 | yes | 活跃 | 3 (168 Hours) | 40 | EAR99 | TxRx + MCU | 2V~3.6V | QUAD | 260 | 1 | 3.3V | 0.5mm | 2.4GHz | CC8520 | 40 | 3.3V | 2 | I2C, SPI | 11dBm | General ISM > 1GHZ | -90dBm | 5Mbps | I2C, I2S, SPI | 2FSK, 8FSK | -86 dBm | 15 | 1mm | 6mm | 6mm | 900μm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||
| CYRF69303-40LFXC | Cypress Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 256B | 表面贴装 | 表面贴装 | 40-VFQFN Exposed Pad | 40 | 15 | 0°C~70°C | Tray | 2011 | PRoC® | Obsolete | 3 (168 Hours) | 40 | 5A991.B.1 | TxRx + MCU | 8542.39.00.01 | 2.7V~3.6V | QUAD | 3V | 0.5mm | 2.4GHz | 40 | 3/3.3V | 8kB Flash 256B SRAM | 8b | M8C | 0dBm | General ISM > 1GHZ | 1Mbps | SPI | 18.9mA~21.9mA | 21.2mA~28.5mA | DSSS, GFSK | -90 dBm | 1mm | 6mm | 无 | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| EFR32FG12P232F1024GM48-C | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | Tray | 柔性壁虎 | 活跃 | 2 (1 Year) | TxRx + MCU | compliant | 2.4GHz | 1MB Flash 128kB RAM | 20dBm | -95dBm | I2C, I2S, SPI, UART | 31 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | TR1001 | Murata Electronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 20-SMD Module | 20 | SM-20H | -40°C~85°C | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 仅TxRx | 85°C | -40°C | 2.2V~3.7V | 868MHz | 3.3V | 1.5dBm | General ISM < 1GHz | -106dBm | 115.2kbps | 1.8mA~3.8mA | 12mA | ASK, OOK | -106 dBm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||
| EFR32BG1B232F128GM32-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | -40°C~85°C | Tape & Reel (TR) | 2016 | yes | Obsolete | 2 (1 Year) | 32 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | 2.4GHz | S-XQCC-N32 | 128kB Flash 32kB RAM | Bluetooth v4.0 | 10.5dBm | Bluetooth | -94dBm | 2Mbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA~126.7mA | 2FSK, 4FSK, GFSK, GMSK, OQPSK | 16 | 0.9mm | 5mm | 5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| EFR32MG1P132F256GM48-C0 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | -40°C~85°C | Tray | 2016 | 活跃 | 2 (1 Year) | 48 | TxRx + MCU | 8542.39.00.01 | 1.85V~3.8V | QUAD | 无铅 | 1 | 3.3V | 0.5mm | 2.4GHz | S-XQCC-N48 | 256kB Flash 32kB RAM | Zigbee® | 16.5dBm | 802.15.4 | -99dBm | 250kbps | I2C, I2S, SPI, UART | 8.7mA | 8.2mA~126.7mA | 31 | 0.9mm | 7mm | 7mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | ATMEGA128RZBV-8CU | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 8kB | 表面贴装 | 100-TFBGA | 100 | 100-CBGA (9x9) | -40°C~85°C | Tray | 2006 | 活跃 | 3 (168 Hours) | TxRx + MCU | 85°C | -40°C | 1.8V~3.6V | 2.4GHz | ATMEGA128 | I2C, SPI | 128kB Flash 4kB EEPROM 8kB SRAM | 6LoWPAN, Zigbee® | 3dBm | 802.15.4 | -101dBm | 250kbps | I2C, JTAG, SPI, USART | 15.5mA | 9.5mA~16.5mA | O-QPSK | -101 dBm | 86 | 86 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||
 | BCM43460KMLG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 22 Weeks | 活跃 | 3 (168 Hours) | 仅TxRx | 2.4GHz 5GHz | 802.11ac | WiFi | 1.3Gbps | 256-QAM | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | OL2385AHN/00100Y | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 18 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2016 | 活跃 | 3 (168 Hours) | TxRx + MCU | 1.9V~5.5V | 260 | 未说明 | 48 | 14dBm | -124dBm | SPI, UART | 29mA | ASK, FSK | 12 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | EFR32BG13P532F512GM48-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | 2018 | Discontinued | 2 (1 Year) | TxRx + MCU | 1.8V~3.8V | compliant | 2.4GHz | 512kB Flash 64kB RAM | Bluetooth v5.0 | 0dBm | 802.15.4, Bluetooth | -102dBm | 2Mbps | I2C, UART, USART | 8.4mA~11mA | 8.5mA~134.3 | 2FSK, 4FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 31 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| EFR32FG13P231F512GM48-BR | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | -40°C~85°C | Tape & Reel (TR) | Discontinued | 2 (1 Year) | 1.8V~3.8V | 169MHz~915MHz | 512kB Flash 64kB RAM | 20dBm | General ISM < 1GHz | 消费电路 | -102dBm | 2Mbps | I2C, UART, USART | 8.4mA~11mA | 8.5mA~134.3 | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, OOK, O-QPSK | 32 | Non-RoHS Compliant |