类别是'射频收发器 IC'
射频收发器 IC (5010)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 类型 | 子类别 | 技术 | 电压 - 供电 | 频率 | 工作频率 | 工作电源电压 | 界面 | 内存大小 | 程序存储器类型 | 程序内存大小 | 输出功率 | 数据总线宽度 | 产品类别 | 工作温度范围 | 议定书 | 功率 - 输出 | 无线电频率系列/标准 | 敏感度 | 数据率(最大) | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 定时器数量 | 调制 | [医]GPIO | 产品类别 | 设备核心 | 高度 | 长度 | 宽度 | |||||||||||||||||||||||
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![]() | 88W8887-A2-NNW2A005 | NXP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 88W8887-A2-NNWA/AK | NXP | 恩智浦半导体 | Details | RF System on a Chip - SoC | 840 | Tray | 88W8887 | Wireless & RF Integrated Circuits | Si | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 88W8787-A1-BKB2E005-P123 | NXP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 88W8787-A1-BKBE/CZ | NXP | 恩智浦半导体 | Details | RF System on a Chip - SoC | 2000 | Reel | 88W8787 | Wireless & RF Integrated Circuits | Si | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 88W8897-B0-CBK2-T | NXP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2000 | PCIe, PCM, SDIO, UART, USB | 88W8897-B0-CBK/AZ | NXP | 恩智浦半导体 | Details | RF System on a Chip - SoC | 867 Mbps | Reel | 88W8897 | Bluetooth | Wireless & RF Integrated Circuits | Si | 2.4 GHz, 5 GHz | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | G1P232F256IM32-C0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EFR32MG1P232F256IM32-C0R | Silicon Laboratories | Silicon Labs | RF System on a Chip - SoC | 2500 | Reel | Wireless & RF Integrated Circuits | Si | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS2000D1-68 | GainSpan | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | -40°C ~ 85°C | * | 活跃 | TxRx + MCU | -- | 2.4GHz | -- | -- | WiFi | -- | 54Mbps | I²C, I²S, SPI, UART | -- | -- | -- | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW43236BKMLG | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CYW43236 | Obsolete | 1680 | Infineon | Infineon Technologies | Details | RF Microcontrollers - MCU | 88-VFQFN Exposed Pad | 88-QFN (10x10) | Infineon Technologies | Tray | - | Tray | - | - | Wireless & RF Integrated Circuits | Si | - | - | - | - | - | - | - | - | - | - | - | - | RF Microcontrollers - MCU | |||||||||||||||||||||||||||||||||
![]() | CYW20703UA1KFFB1GT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | CYW20703 | 活跃 | 2500 | Infineon | Infineon Technologies | Details | RF Microcontrollers - MCU | - | Infineon Technologies | Tape & Reel (TR) | - | Reel | - | - | Wireless & RF Integrated Circuits | Si | - | - | - | - | - | - | - | - | - | - | - | - | RF Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||
![]() | CYW20734UA2KFFB3GT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Infineon | Infineon Technologies | RF Microcontrollers - MCU | 2500 | Reel | CYW20734 | Wireless & RF Integrated Circuits | Si | RF Microcontrollers - MCU | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20719B2KWB9GT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 活跃 | 5000 | Infineon | Infineon Technologies | Details | RF Microcontrollers - MCU | 134-BGA, WLCSP | 134-WLCSP (3.31x3.22) | Infineon Technologies | Tape & Reel (TR) | -30°C ~ 85°C (TA) | Reel | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.76V ~ 3.63V | 2.4GHz | 1MB Flash, 2MB ROM, 512kB RAM | Bluetooth v5.1 | 5.5dBm | Bluetooth | -95.5dBm | 3Mbps | GPIO, HCI, I²C, I²S, PCM, PWM, SPI, UART | 5.9mA | 5.6mA | 8-DPSK, 4-DQPSK, GFSK, QPSK | 40 | RF Microcontrollers - MCU | |||||||||||||||||||||||||||||||||
![]() | CYW89373BUBGT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | CYW89373 | 活跃 | 5000 | Infineon | Infineon Technologies | Details | Infineon Technologies | Tape & Reel (TR) | Reel | - | Infineon | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NRF52810-QFAA-E-R7 | Nordic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | NRF52810 | 活跃 | 24 kB | RAM | 11.2 mA | SPI | 15.4 mA | SMD/SMT | 1.7 V | - 40 C | 3.6 V | + 85 C | 2 Mbps | 32 I/O | 64 MHz | 48-VFQFN Exposed Pad | 48-QFN (6x6) | Nordic Semiconductor ASA | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -40°C ~ 85°C (TA) | - | TxRx + MCU | Wireless & RF Integrated Circuits | Si | 1.7V ~ 3.6V | 2.4GHz | 2360 MHz to 2500 MHz | 1.7 V to 3.6 V | 192kB Flash, 24kB RAM | Flash | 192 kB | 8 dBm | 32 bit | - 40 C to + 85 C | Bluetooth, Thread | -96dBm | Bluetooth | -96dBm | 2Mbps | 8 Channel | I²C, PCM, PWM, SPI, UART | 4.6mA | 4.6mA ~ 7mA | 3 Timer | FSK | 21 | RF System on a Chip - SoC | 0.85 mm | 6 mm | 6 mm | |||||||||||||
![]() | CSRA67064A01-CQQH-T | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 最后一次购买 | Qualcomm | Tray | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW4330GKWBGT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | CYW4330 | Obsolete | 225-XFBGA, WLCSP | 225-WLCSP (4.89x5.33) | Infineon Technologies | Tape & Reel (TR) | -30°C ~ 85°C | - | TxRx + MCU | 2.3V ~ 4.8V | 2.4GHz, 5GHz | - | 802.11a/b/g/n, Bluetooth v4.0 | 12dBm | Bluetooth, WiFi | -95dBm | 72Mbps | I²S, JTAG, SPI, UART, USB | 52mA ~ 60mA | 300mA ~ 325mA | 4DQPSK, 8DPSK, GFSK | 7 | |||||||||||||||||||||||||||||||||||||||||
![]() | DA14583-01F01AT1 | Renesas | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | DA14583 | 不用于新设计 | MSL 3 - 168 hours | - | 40-VFQFN Exposed Pad | 40-QFN (5x5) | Renesas Design Germany GmbH | Tray | -40°C ~ 85°C | - | TxRx + MCU | 2.35V ~ 3.3V | 2.4GHz | I2C, SPI, UART | 1Mb Flash, 32kB OTP, 84kB ROM, 50kB SRAM | 1140KB | 32bit | Bluetooth v4.1 | -1dBm | Bluetooth | -93dBm | - | I²C, SPI, UART | 3.7mA | 3.4mA | - | 24 | ARM Cortex-M0 | |||||||||||||||||||||||||||||||||||
![]() | TLSR8355F512ET48 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 I/O | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.9 mA | I2S, SPI, UART, USB | 4.6 mA | SRAM | 32 kB | QFN-48 | 32 MHz | TLSR835X | Wi-Fi | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 512 kB | 10 dBm | 32 bit | - 94 dBm | 10 Channel | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||
![]() | TLSR8271F512ET32 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 19 I/O | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.9 mA | I2C, I2S, SPI, UART | 4.6 mA | SRAM | 32 kB | QFN-32 | 32 MHz | TLSR827X | BLE | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 512 kB | 10 dBm | 32 bit | - 93 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||
![]() | TLSR8232F128ET24 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.9 V | SMD/SMT | 25 mA | I2C, SPI, UART | 16 mA | SRAM | 16 kB | QFN-24 | 32 kHz | TLSR823X | BLE 5.0 | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 128 kB | 8 dBm | 32 bit | - 91 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||
![]() | TLSR8253F512AT32 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Mbps | + 125 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.8 mA | I2C, I2S, SPI, UART, USB | 5.3 mA | SRAM | 48 kB | QFN-32 | 32 MHz | TLSR825X | BLE 5.0 | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 512 kB | 10 dBm | 32 bit | - 93 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||
![]() | TLSR8253F512ET32 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 17 I/O | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.8 mA | I2C, I2S, SPI, UART, USB | 5.3 mA | SRAM | 48 kB | QFN-32 | 32 MHz | TLSR825X | BLE 5.0 | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 512 kB | 10 dBm | 32 bit | - 93 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||
![]() | TLSR8258F512ET48 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 32 I/O | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.8 mA | I2C, I2S, SPI, UART, USB | 5.3 mA | SRAM | 64 kB | QFN-48 | 32 MHz | TLSR825X | BLE 5.1, multi-antenna AoA/AoD, BLE Mesh, 802.15.4, Zigbee 3.0, RF4CE, HomeKit, Dual-Mode, 2.4G Proprietary | Wireless & RF Integrated Circuits | Si | 2.4 GHz | 512 kB | 10 dBm | 32 bit | - 93 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||
![]() | TLSR8367EP16 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | + 85 C | 3.6 V | - 40 C | 1.9 V | 25 mA | 13.6 mA | SRAM | 8 kB | 2 Mbps | TLSR836X | ISM | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 16 kB | 7 dBm | 32 bit | - 86.5 dBm | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||||||||
![]() | NRF52805-CAAA-B-R | Nordic | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | NRF52805 | 活跃 | 28-UFBGA, WLCSP | 28-WLCSP (2.48x2.46) | Nordic Semiconductor ASA | Tape & Reel (TR) | -40°C ~ 85°C | nRF52 | TxRx + MCU | 1.7V ~ 3.6V | 2.4GHz | 192kB Flash, 24kB RAM | Bluetooth v5.0 | 4dBm | Bluetooth | -97dBm | 2Mbps | I²C, SPI, UART | 3.5mA ~ 11.2mA | 2.1mA ~ 15.4mA | FSK | 10 | |||||||||||||||||||||||||||||||||||||||||
![]() | BCM3413IMLG | Broadcom | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | BCM3413 | 最后一次购买 | Broadcom Limited | Bulk | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TLSR8355F128ET24 | LINKSEMI | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 I/O | 2 Mbps | + 85 C | 3.6 V | - 40 C | 1.8 V | SMD/SMT | 4.9 mA | SPI, UART, USB | 4.6 mA | SRAM | 32 kB | QFN-24 | 32 MHz | Wi-Fi | Wireless & RF Integrated Circuits | Si | 2.4 GHz | Flash | 128 kB | 10 dBm | 32 bit | - 94 dBm | 10 Channel | 3 x 32 bit | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||
![]() | CYW43340HKUBGT | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Obsolete | 141-UFBGA, WLBGA | 141-WLBGA (5.67x4.47) | Infineon Technologies | Tape & Reel (TR) | -30°C ~ 85°C | - | TxRx + MCU | 1.2V ~ 3.3V | 2.4GHz, 5GHz | 640kB ROM, 512kB SRAM | 802.11a/b/g/n, Bluetooth v4.0 | 11dBm | Bluetooth, WiFi | -94.5dBm | 150Mbps | I²C, I²S, JTAG, SPI, UART | 44.4mA ~ 57.7mA | 254mA ~ 325mA | 8DPSK, DQPSK, GFSK | 8 |