N/A

-

表面贴装

A1101R09

活跃

24-BLGA

TTM Technologies, Inc.

Tray

-40°C ~ 85°C

AIR™

1.8V ~ 3.6V

902MHz ~ 928MHz

-

500kbps

CC1101

-

10dBm

General ISM < 1GHz

Integrated, Trace

-112dBm

SPI

15mA

-

-

N/A

-

表面贴装

不用于新设计

Module

Kaga Electronics USA

Bulk

-

-

3V ~ 3.6V

2.4GHz

-

-

-

Bluetooth v2.1 +EDR

4dBm

Bluetooth

-

-83dBm

-

40mA

-

-

N/A

-

表面贴装

Obsolete

Module

Infineon Technologies

Box

-

-

3V ~ 3.6V

2.4GHz

-

62.5kbps

-

-

16dBm

General ISM > 1GHz

-

-95dBm

SPI

-

146.8mA ~ 186mA

GFSK

N/A

-

面板安装

D38999/20ZG

22D

活跃

External

有

+ 85 C

3.6 V

0.014815 oz

- 40 C

70

1.8 V

SMD/SMT

5.3 mA

GPIO, I2C, SPI, UART

- 96 dBm

5.4 mA

莱尔德连接

莱尔德连接

External

NFC

Details

Class 2

14 mm x 10 mm x 2.1 mm

多协议模块

Flange

Circular

Aluminum

-

Amphenol Aerospace Operations

Bulk

-65°C ~ 175°C

Bulk

Military, MIL-DTL-38999 Series III, Tri-Start™ TV

插座外壳

用于内螺纹插座

79

Threaded

Wireless & RF Modules

Crimp

N (Normal)

Shielded

抗环境干扰

2.44 GHz

锌 镍

21-35

Black

1.8 V to 3.6 V

不包括触点

G

4 dBm

1 Mb/s

Bluetooth 5.0

-

- 96 dBm

-

多协议模块

-

N/A

-

最后一次购买

Axial

Axial

FreeWave Technologies

Bulk

-65°C ~ 175°C

Tape & Reel (TR)

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

活跃

2

±50ppm/°C

28.4 kOhms

Metal Film

0.125W, 1/8W

S (0.001%)

Military, Moisture Resistant, Weldable

--

N/A

-

表面贴装

+70 °C

-20 °C

-93dBm

4dBm

0804, Concave, Long Side Terminals

8

0804

9 x 9.5 x 1.8mm

-55°C ~ 155°C

Tape & Reel (TR)

RACF

0.079 L x 0.039 W (2.00mm x 1.00mm)

±5%

活跃

±200ppm/°C

--

4

Isolated

62.5mW

--

100

--

1.8mm

0.020 (0.50mm)

9.5mm

9mm

N/A

-

100

Quectel

Quectel

Compliant

Reel

5.5 kW

500 V

Quectel Wireless Solutions

N/A

-

N/A

-

表面贴装

表面贴装

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

BG95

活跃

23.6 mm x 19.9 mm x 2.2 mm

+ 75 C

4.3 V

- 35 C

3.3 V

GPIO, I2C, UART, USB

Industrial grade

Module

Quectel

LGA

-35 to 75 °C

-

LTE Cat M1/Cat NB2/EGPRS Module

3.3V ~ 4.3V

850MHz, 900MHz, 1.8GHz, 1.9GHz

1024

1 V

-

23 dBm

1.119Mbps

-

BeiDou, EGDE, Galileo, GLONASS, GPS, GNSS, GSM, LTE

700/800/850/900/1700/1800/1900/2100 MHz

Industrial

32dBm

Cellular, Navigation

不包括天线

-

GPIO, I²C, PCM, UART, USB

-

-

-

N/A

-

N/A

-

面板安装

Bulk

Metal

KJB7T

活跃

Gold

Bulkhead - Front Side Nut

铝合金

ITT Cannon, LLC

-

-65°C ~ 200°C

KJB

Crimp

Receptacle, Female Sockets

66

-

Threaded

-

E

-

抗环境干扰

化学镍

19-35

-

-

50.0µin (1.27µm)

N/A

-

表面贴装

活跃

UG95

Module

PEI-Genesis

Bulk

-40°C ~ 85°C

*

Wireless & RF Modules

3.3V ~ 4.3V

850MHz, 1.9GHz

-

7.2Mbps

-

UMTS

24dBm

Cellular

不包括天线

-110.5dBm

I²C, PCM, UART, USB

1.15mA

-

-

射频模块

N/A

-

Free Hanging (In-Line)

NF17

-

8 A

活跃

磷青铜

300 V

-

Module

Thermoplastic

Amphenol Anytek

Bulk

-40°C ~ 115°C

NF

Plug, Female Sockets

17 (Mate), 34 (Input)

Green

Wireless & RF Modules

0.200 (5.08mm)

3.3V ~ 4.3V

-

0.870 (22.10mm)

6GHz

Screwless - Leg Spring, Push-In Spring

-

-

1 (Mate), 2 (Input)

Tin

2.5Gbps

12-26 AWG

17 (Mate), 34 (Input)

-

180°

-

-

11-12mm

BeiDou, Galileo, GLONASS, GPS, GNSS, LTE, WCDMA

-

26dBm

Cellular, Navigation

不包括天线

-

ADC, GPIO, I²C, I²S, PCM, SDIO, UART, SPI, USB

16mA

16mA

-

Mating Flange, Retention Latches (Non-Wire Side)

GPS模块

UL94 V-0

N/A

-

Free Hanging (In-Line)

Bulk

Metal

2M801-008

活跃

Copper Alloy

Gold

-90dBm

15dBm

+ 70 C

4.2 V

- 20 C

56

3.2 V

SMD/SMT

UART

Microchip

Microchip Technology / Atmel

Integrated

Details

Class 1, Class 2

Bluetooth Modules - 802.15.1

43-SMD Module

-

铝合金

Polyphenylene Sulfide (PPS)

-

Amphenol Aerospace Operations

-

-65°C ~ 150°C

Tray

2M

Crimp

Plug, Female Sockets

26

橄榄色

-

Threaded

Wireless & RF Modules

5A

3.2V ~ 4.2V

B

Shielded

IP67 - Dust Tight, Waterproof

2.44 GHz

橄榄色镉

10-26

3.2 V to 4.2 V

-

-

15 dBm

-

3Mbps

-

Bluetooth 5.0

2.402 GHz to 2.48 GHz

2dBm

Bluetooth

Integrated, Trace

-90dBm

I²S, UART

-

-

8DPSK, DQPSK, GFSK

蓝牙模块

联接螺母

蓝牙模块

2.5 mm

32 mm

15 mm

50.0µin (1.27µm)

-

N/A

-

活跃

420

Broadcom Limited

Broadcom

Gateways

0603 (1608 Metric)

0603

Kamaya Inc.

Tape & Reel (TR)

-55°C ~ 155°C

RMC

0.063 L x 0.031 W (1.60mm x 0.80mm)

±5%

2

±200ppm/°C

914 Ohms

厚膜

0.1W, 1/10W

Ethernet & Communication Modules

-

-

Gateways

0.022 (0.55mm)

-

N/A

-

表面贴装

活跃

EG91

29 mm x 25 mm x 2.3 mm

+ 75 C

3.8 V

- 35 C

3.8 V

I2C, PCM, SPI, UART, USB, USIM

29 mA

Module

PEI-Genesis

Bulk

-35°C ~ 75°C

*

3.3V ~ 4.3V

-

3.8 V

-

42Mbps

-

BeiDou, Galileo, GLONASS, GPS, GNSS, LTE, UMTS, WCDMA

-

Cellular, Navigation

不包括天线

-

I²C, PCM, SPI, UART, USB

29mA

29mA

-

N/A

-

表面贴装

532

活跃

4-SMD, No Lead

CTS-Frequency Controls

Tape & Reel (TR)

-40°C ~ 85°C

532

0.197 L x 0.126 W (5.00mm x 3.20mm)

TCXO

3.3V

40 MHz

±2.5ppm

削波正弦波

-

Crystal

2.5mA

-

-

-

0.065 (1.65mm)

-

N/A

-

表面贴装

活跃

表面贴装

LC79

Industrial grade

26-SMD Module

PEI-Genesis

Bulk

-40 to 85 °C

*

Multi-Constellation GNSS Module

1.7V ~ 1.9V

1.176GHz, 1.561GHz, 1.575GHz, 1.602GHz

1.8 V

-

-

-

BeiDou, Galileo, GLONASS, GPS, GNSS

1176.45/1561.098/1575.42/1602.56 MHz

Industrial

-

Navigation

不包括天线

-163dBm

I²C, SPI, UART

-

-

-

N/A

-

表面贴装

有

+ 85 C

3.8 V

- 40 C

490

1.8 V

SMD/SMT

4.6 mA

I2C, SPI, UART

- 95.9 dBm

4.2 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

Tray

BGM220

活跃

6 mm x 6 mm x 1.1 mm

Bluetooth Modules - 802.15.1

44-SMD Module

Silicon Labs

Chip

-40°C ~ 85°C (TA)

Tray

-

Wireless & RF Modules

1.8V ~ 3.8V

Shielded

2.44 GHz

1.8 V to 3.8 V

32 kB, 352 kB

6 dBm

2Mbps

EFR32BG22

Bluetooth 5.2

2.4 GHz to 2.4835 GHz

6dBm

Bluetooth

Integrated, Chip

- 98.6 dBm

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

4.2mA ~ 4.8mA

4.6mA ~ 8.8mA

GFSK

蓝牙模块

GFSK

蓝牙模块

1.1 mm

6 mm

6 mm

N/A

-

表面贴装

有

+ 85 C

3.8 V

- 40 C

2500

1.8 V

SMD/SMT

4.6 mA

I2C, SPI, UART

- 95.9 dBm

4.2 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

Tape & Reel (TR);Cut Tape (CT);

BGM220

活跃

6 mm x 6 mm x 1.1 mm

Bluetooth Modules - 802.15.1

44-SMD Module

Silicon Labs

Chip

-40°C ~ 85°C (TA)

切割胶带

-

Wireless & RF Modules

1.8V ~ 3.8V

Shielded

2.44 GHz

1.8 V to 3.8 V

32 kB, 352 kB

6 dBm

2 Mb/s

EFR32BG22

Bluetooth 5.2

2.4 GHz to 2.4835 GHz

6dBm

Bluetooth

Integrated, Chip

- 98.6 dBm

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

4.2mA ~ 4.8mA

4.6mA ~ 8.8mA

GFSK

蓝牙模块

GFSK

蓝牙模块

1.1 mm

6 mm

6 mm

N/A

-

表面贴装

3.8(V)

3(V)

无

1.8(V)

-40C

Chip

有

+ 85 C

3.8 V

- 40 C

490

1.8 V

SMD/SMT

4.6 mA

I2C, SPI, UART

- 95.9 dBm

4.2 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

Tray

BGM220

活跃

Bluetooth Modules - 802.15.1

31-SMD Module

Silicon Labs

85C

-40°C ~ 85°C (TA)

Tray

-

Wireless & RF Modules

1.8V ~ 3.8V

Shielded

2.44 GHz

1.8 V to 3.8 V

32 kB, 352 kB

6 dBm

2Mbps

EFR32BG22

Bluetooth 5.2

2.4 GHz to 2.4835 GHz

0dBm

Bluetooth

Integrated, Chip

- 98.6 dBm

2000(kbps)

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

4.3mA ~ 4.8mA

4.8mA ~ 10.8mA

GFSK

蓝牙模块

GFSK

蓝牙模块

1.1 mm

6 mm

6 mm

N/A

-

15

Fanstel

Fanstel

多协议模块

u.FL

Wireless & RF Modules

LTE Cat M1, NBIoT, Bluetooth

多协议模块

N/A

-

表面贴装

u-blox

u-blox

Tape & Reel (TR)

活跃

PCB

10 mm x 14 mm

+ 85 C

3.6 V

- 40 C

1.7 V

SMD/SMT

300 m

5.3 mA

I2C, I2S, SPI, UART

- 95 dBm

5.4 mA

Bluetooth Low Energy (BLE)

Bluetooth Modules - 802.15.1

30-SMD Module

u-blox

500

-40°C ~ 85°C

NINA-B1

Wireless & RF Modules

1.7V ~ 3.6V

Shielded

2.4GHz

1.7 V to 3.6 V

512kB Flash, 64KB RAM

6 dBm

2Mbps

nRF52832

Bluetooth v5.0

6dBm

Bluetooth

Integrated, Chip

-95dBm

ADC, GPIO, I²C, SPI, UART

5.4mA

5.3mA

GFSK

蓝牙模块

蓝牙模块

14 mm

10 mm

N/A

-

表面贴装

u-blox

u-blox

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

Bluetooth Modules - 802.15.1

55-SMD Module

u-blox

500

-40°C ~ 85°C

NINA-B3

Wireless & RF Modules

1.7V ~ 3.6V

2.4GHz

1MB Flash, 256kB RAM

2Mbps

nRF52840

Bluetooth v5.0

10.5dBm

802.15.4, Bluetooth

不包括天线

-100dBm

ADC, GPIO, I²C, I²S, PDM, PWM, SPI, UART, USB

4.8mA

4.9mA ~ 14.1mA

-

蓝牙模块

N/A

-

表面贴装

u-blox

u-blox

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

Bluetooth Modules - 802.15.1

55-SMD Module

u-blox

500

-40°C ~ 85°C

NINA-B3

Wireless & RF Modules

1.7V ~ 3.6V

2.4GHz

1MB Flash, 256kB RAM

2Mbps

nRF52840

Bluetooth v5.0

10dBm

802.15.4, Bluetooth

Integrated, Trace

-100dBm

ADC, GPIO, I²C, I²S, PDM, PWM, SPI, UART, USB

4.8mA

4.9mA ~ 14.1mA

-

蓝牙模块