类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 制造商包装标识符 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 通道数量 | 界面 | 内存大小 | 电源电流 | 最大电源电流 | uPs/uCs/外围ICs类型 | 输出功率 | 位元大小 | 有ADC | DMA 通道 | 数据率 | 脉宽调制通道 | 数模转换器通道 | 使用的 IC/零件 | 带宽 | 议定书 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 消费者集成电路类型 | 敏感度 | ADC通道数量 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 通用输入输出数量 | 环境温度范围高 | 固件版本 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | ||||||||||||||||||||||
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 | ETRX357-LRS | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | NO | -40°C~85°C | Tape & Reel (TR) | 活跃 | 3 (168 Hours) | 33 | 8542.39.00.01 | 2.1V~3.6V | DUAL | 无铅 | 1 | 3V | 1.27mm | 2.4GHz | R-XDMA-N33 | 192kB Flash 12kB RAM | 250kbps | EM357 | Zigbee® | 电信电路 | 20dBm | 802.15.4 | Integrated, Chip | -106dBm | 33mA | 140mA | 25mm | 19mm | 无SVHC | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BM78SPP05NC2-0002AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 30-SMD Module | YES | -20°C~70°C | Tray | 活跃 | 1 (Unlimited) | 8542.39.00.01 | 3.3V~4.2V | UNSPECIFIED | 无铅 | 1 | 1.9V | 2.4GHz | BM78 | X-XXMA-N | Bluetooth v4.2 | 电信电路 | 1.5dBm | Bluetooth | 不包括天线 | -92dBm | UART | 37mA | 43mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RN2903A-I/RM098 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tray | 2017 | yes | Obsolete | 1 (Unlimited) | 2.1V~3.6V | 902MHz~928MHz | RN2903 | 300kbps | LoRa™ | 18.5dBm | General ISM < 1GHz | Antenna Not Included, Castellation | -146dBm | UART | 1.8mA~3.1mA | 42.6mA~124.4mA | FSK, GFSK | 0.9.8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | EC25AFA-512-STD | Quectel | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | ADC, I2C, SDIO, SGMII, UART, USB | - 35 C | + 75 C | 有 | 250 | 3.8 V | 无线通信模块 | 0.163318 oz | LCC | LTE Category 4 Module | 表面贴装 | 3.8 V | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | EC25 | 活跃 | SMA | - | 32 mm x 29 mm x 2.4 mm | - | Industrial grade | 卡边缘 | Module | Quectel | Details | -40 to 85 °C | 切割胶带 | - | 3V ~ 3.6V | 1.561GHz, 1.575GHz, 1.602GHz | 3.8 V | - | 33 dBm | 480Mbps | - | BeiDou, EDGE, Galileo, GLONASS, GPS, GNSS, LTE, WCDMA | Industrial | 33dBm | Cellular, Navigation | 不包括天线 | -110.5dBm | I²C, PCM, UART, USB | - | - | 8PSK, 16QAM, 64QAM, GMSK | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BGM113A256V2 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 36-SMD Module | YES | -40°C~85°C | Strip | 2016 | 蓝壁虎 | 活跃 | 3 (168 Hours) | 36 | 3.8V | UNSPECIFIED | 无铅 | 1 | 3.3V | 0.8mm | 2.4GHz | R-XXMA-N36 | I2C, I2S, IrDA, SMBus, SPI, UART, USART | 256kB Flash 32kB RAM | 200mA | 1Mbps | EFR32BG | 83.5MHz | Bluetooth v4.1 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -93dBm | 1 | SPI, UART | 8.7mA | 8.8mA | 14 | 85°C | 2mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BM70BLES1FC2-0002AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | Gold | 表面贴装 | 表面贴装 | Module | 33 | -20°C~70°C | Bulk | 2015 | yes | 活跃 | 1 (Unlimited) | 33 | 1.9V~3.6V | UNSPECIFIED | 无铅 | 1 | 3V | 2.4GHz | BM70 | 3.6V | I2C, SPI, UART | 256kB Flash 32kB ROM 24kB SRAM | 13mA | 8.6 Mbps | Bluetooth v5.0 | 电信电路 | 2dBm | Bluetooth | Integrated, Chip | I2C, SPI, UART | -90 dBm | 1.03 | 2.4mm | 22mm | 12mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATZB-RF-233-1-CR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 13 Weeks | 表面贴装 | 表面贴装 | Module | 42 | ATZB-RF-233-1-CR | Industrial grade | -40°C~85°C | Cut Tape (CT) | 2014 | ZigBit™ | yes | Discontinued | 3 (168 Hours) | 2V~3.6V | 2.4GHz | 2Mbps | AT86RF233 | 83.5MHz | Zigbee® | 19.9dBm | 802.15.4 | Integrated, Chip | SPI | 7.5mA~17mA | 157mA | -105 dBm | 3.2mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BM64SPKS1MC1-0001AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | YES | -20°C~70°C | Bulk | 2016 | yes | 活跃 | 1 (Unlimited) | 43 | 3.2V~4.2V | UNSPECIFIED | 无铅 | 未说明 | 1 | 1.2mm | 2.4GHz | 未说明 | BM64 | R-XXMA-N43 | 4.2V | 3.2V | 3Mbps | Bluetooth v5.0 | 15dBm | Bluetooth | Integrated, Trace | 消费电路 | -90dBm | I2S, UART | 15mA | 8DPSK, DQPSK, GFSK | DSPK1.1 | 2.56mm | 32mm | 15mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MRF24WG0MBT-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 36-SMD Module | 36 | -40°C~85°C | Tape & Reel (TR) | 2011 | 活跃 | 3 (168 Hours) | 36 | 8542.39.00.01 | 2.8V~3.6V | 3.3V | 2.4GHz | MRF24WG0M | 不合格 | 3.6V | 3.3V | 54Mbps | 802.11b/g | 18dBm | WiFi | Antenna Not Included, U.FL | SPI | 156mA | 226mA~237mA | DSSS, OFDM | -95 dBm | 310C | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATWINC1500-MR210PB1952 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | YES | Automotive grade | -40°C~85°C | Tray | 2017 | 活跃 | 3 (168 Hours) | 28 | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 2.4GHz | ATWINC1500 | R-XXMA-N28 | I2C, SPI, UART | 4MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | 60MHz | 802.11b/g/n | TS 16949 | 18.5dBm | WiFi | Integrated, Trace | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 5 | 19.5.2 | 2.113mm | 21.72mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BM77SPP03MC2-0007AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 14 Weeks | 表面贴装 | 表面贴装 | 30-SMD Module | 30 | -20°C~70°C | Tray | 2003 | 活跃 | 3 (168 Hours) | 33 | 8542.39.00.01 | 3.2V~4.3V | QUAD | 无铅 | 未说明 | 1 | 2.4GHz | 未说明 | BM77 | R-XQMA-N33 | 50kbps | Bluetooth v4.0 Dual Mode | 电信电路 | 2dBm | Bluetooth | 不包括天线 | UART | 70mA | -92 dBm | 1.42 | 2.46mm | 22mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ENW-89837A3KF | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 表面贴装 | Module | 58 | -40°C~85°C | Tape & Reel (TR) | 2013 | PAN1026 | 不用于新设计 | 3 (168 Hours) | 58 | 8542.39.00.01 | 1.7V~3.6V | UNSPECIFIED | 无铅 | 250 | 1 | 1.8V | unknown | 2.4GHz | 10 | 3.3V | I2C, SPI, UART, USB | 4.3Mbps | TC35661 | Bluetooth v4.0 Dual Mode | 电信电路 | 4dBm | Bluetooth | Integrated, Chip | I2C, SPI, UART, USB | -87 dBm | 14 | 85°C | 2mm | 15.6mm | 8.7mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BLE121LR-A-M256K | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 36 | -40°C~85°C | Tape & Reel (TR) | 2014 | 活跃 | 3 (168 Hours) | 36 | 2V~3.6V | UNSPECIFIED | 无铅 | 1 | 3V | 0.9mm | 2.4GHz | 3.6V | I2C, SPI, UART | 256kB Flash 8kB SRAM | 36mA | 2Mbps | CC2541 | Bluetooth v4.0 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | 8 | I2C, SPI, UART | 28mA~33mA | 25mA~39mA | -98 dBm | 16 | 1.8mm | 14.7mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATWINC1510-MR210PB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 40 | Industrial grade | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 28 | SEATED HGT-NOM | 2.7V~3.6V | UNSPECIFIED | 无铅 | 未说明 | 3.6V | 2.4GHz | 未说明 | R-XXMA-N28 | 3.6V | 1 | I2C, SPI, UART | 8MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | 802.11b/g/n | 18.5dBm | WiFi | Integrated, Trace | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | -98 dBm | 19.4.4 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BM23SPKS1NB9-0B02AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 43-SMD Module | YES | -20°C~70°C | Tray | 2017 | BM23 | 活跃 | 3 (168 Hours) | 43 | 3V~4.2V | UNSPECIFIED | 无铅 | 1 | 3.7V | 1.2mm | 2.4GHz | R-XXMA-N43 | Bluetooth v4.1 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | -91dBm | I2C, UART | 8DPSK, DQPSK, GFSK | 1.9mm | 29mm | 15mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATSAMR21G18-MR210UA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 48 | 18 | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 42 | 1.8V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 2.4GHz | ATSAMR21G | R-XXMA-N42 | 3.3V | 1 | SPI, UART, USB | 256kB Flash | 10mA | MICROCONTROLLER, RISC | 32 | YES | NO | 12 Mbps | NO | NO | Zigbee® | 3.5dBm | 802.15.4 | SPI, UART, USB | -98 dBm | 20mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BLE112-A-V1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 30 | BLE112-A-V1 | -40°C~85°C | Tape & Reel (TR) | 2011 | 活跃 | 3 (168 Hours) | 31 | 8542.39.00.01 | 2V~3.6V | UNSPECIFIED | 1 | 1.25mm | 2.4GHz | R-XXMA-N31 | SPI, UART | 128kB Flash 8kB SRAM | 2Mbps | CC2540 | Bluetooth v4.0 | 电信电路 | 3dBm | Bluetooth | Integrated, Chip | -85dBm | SPI, UART | 25mA | 36mA | -87 dBm | 2.3mm | 18.1mm | 12.05mm | 无 | 无SVHC | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATBTLC1000-MR110CA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 24-SMD Module | -40°C~85°C | Tray | 2015 | yes | 活跃 | 3 (168 Hours) | 24 | 1.8V~4.3V | UNSPECIFIED | 无铅 | 1 | 3.6V | 0.9mm | 2.4GHz | ATBTLC1000 | R-XXMA-N24 | I2C, SPI, UART | 128kB ROM 128kB RAM | Bluetooth v4.1 | 电信电路 | 3.5dBm Max | Bluetooth | Integrated, Chip | I2C, SPI, UART | 4.2mA | 3mA | -95 dBm | 2.165mm | 20.015mm | 12.7mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATWINC1510-MR210PB1952 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | YES | Automotive grade | -40°C~85°C | Tray | 2017 | 活跃 | 3 (168 Hours) | 28 | 2.7V~3.6V | UNSPECIFIED | 无铅 | 3.3V | 2.4GHz | R-XXMA-N28 | 8MB Flash 128kB RAM | 微处理器电路 | 72.2Mbps | 802.11b/g/n | TS 16949 | 18.5dBm | WiFi | Integrated, Trace | -95dBm | I2C, SPI, UART | 61mA | 265mA | 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK | 19.5.2 | 2.11mm | 21.72mm | 14.73mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | BGM111A256V21R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 2007 | 蓝壁虎 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.65V~3.8V | 2.4GHz | 256kB Flash 32kB RAM | 1Mbps | EFR32BG | Bluetooth v4.2 | 电信电路 | 8dBm | Bluetooth | Integrated, Chip | -92dBm | I2C, SPI, UART | 8.7mA | 8.2mA | GFSK | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RN41XVC-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | 通孔 | 20-DIP Module | 20 | -40°C~85°C | Bulk | 2009 | yes | 活跃 | 1 (Unlimited) | 20 | 3V~3.6V | DUAL | 未说明 | 1 | 3.3V | 2.4GHz | 未说明 | RN41XV | 3.3V | UART, USB | 100mA | 300kbps | Bluetooth v2.1 +EDR, Class 1 | 电信电路 | 16dBm | Bluetooth | Integrated, Chip | UART | 35mA | 65mA | FHSS, GFSK | -80 dBm | 6.3 | 2mm | 29.9mm | 24.4mm | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RN42SM-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | Module | 35 | Automotive grade | -40°C~85°C | Tray | 2009 | 活跃 | 3 (168 Hours) | 32 | UNSPECIFIED | 无铅 | 1 | 3.3V | 2.4GHz | RN42 | R-XXMA-N32 | 3.3V | RS-232, UART | 85mA | 3Mbps | Bluetooth v2.1 +EDR, Class 2 | TS 16949 | 电信电路 | 2dBm | Bluetooth | Integrated, Chip | -80dBm | UART | 35mA | 65mA | FHSS, GFSK | -80 dBm | 6.3 | 2.4mm | 25.8mm | 13.4mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | ATWILC1000-MR110UB | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 28-SMD Module, Exposed Pad | 40 | Industrial grade | -40°C~85°C | Tray | 2016 | 活跃 | 3 (168 Hours) | 28 | 8542.39.00.01 | 3.3V | UNSPECIFIED | 无铅 | 1 | 3.6V | 2.4GHz | ATWILC1000 | R-XXMA-N28 | I2C, SPI, UART | 65Mbps | 802.11b/g/n | 电信电路 | 19dBm | WiFi | Antenna Not Included, U.FL | I2C, SPI, UART | 68mA | 230mA | -98 dBm | 2.113mm | 21.72mm | 14.73mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RN42XVU-I/RM | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | 通孔 | 20-DIP Module | 20 | -40°C~85°C | Bulk | 2009 | yes | 活跃 | 3 (168 Hours) | 20 | 3V~3.6V | DUAL | 1 | 3.3V | 2.4GHz | RN42XV | 3.3V | UART, USB | 300kbps | Bluetooth v2.1 +EDR, Class 2 | 电信电路 | 4dBm | Bluetooth | Antenna Not Included, U.FL | UART | 45mA | 45mA | FHSS, GFSK | -80 dBm | 6.15 | 2mm | 29mm | 24.4mm | 无SVHC | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | RN2483A-I/RM103 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | Industrial grade | -40°C~85°C | Tray | 2015 | yes | Discontinued | 1 (Unlimited) | 2.1V~3.6V | 433MHz 868MHz | RN2483 | UART | 300kbps | 1.74MHz | LoRa™ | 14dBm | General ISM < 1GHz | Antenna Not Included, Castellation | -146dBm | 13 | I2C, SPI, UART | 14mA | 39mA | FSK, GFSK | 14 | 1.0.3 | 3.467mm | ROHS3 Compliant |