N/A

-

不用于新设计

表面贴装

Module

--

Kaga Electronics USA

Bulk

-20°C ~ 75°C

--

活跃

3.3V

2.4GHz

32kB EEPROM

3Mbps

-

18mm

Socket

Bluetooth v2.1 +EDR

12 Point Socket

4dBm

Bluetooth

-

-83dBm

SPI, UART, USB

40mA

1/2

-

DPSK, DQPSK, GFSK

镀铬表面处理

1.49 (37.8mm)

N/A

-

活跃

表面贴装

23-SMD Module

Glenair

零售包装

-40°C ~ 85°C

Tray

*

活跃

2.2 V ~ 3.8 V

865MHz ~ 870MHz

128kB Flash, 20kB RAM

100Kbps

--

--

14dBm

通用ISM

Not Included, Castellation

-124dBm

UART

8mA

26mA

DSSS, FSK, GFSK, GMSK, MSK, OOK

N/A

-

8 Weeks

活跃

Non-Compliant

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

UNSPECIFIED

-20 °C

1.2 V

70 °C

IS2020S-203-TRAY

HVQCCN

SQUARE

Microchip Technology Inc

活跃

MICROCHIP TECHNOLOGY INC

5.06

Production (Last Updated: 2 years ago)

YES

56

Glenair

零售包装

*

CMOS

QUAD

无铅

1

0.4 mm

compliant

S-XQCC-N56

OTHER

0.9 mm

电信电路

7 mm

7 mm

N/A

-

活跃

KYOCERA AVX

Bulk

*

N/A

-

活跃

Glenair

零售包装

*

N/A

-

有

348

Silicon Laboratories

Silicon Labs

Z-WAVE

RF System on a Chip - SoC

表面贴装

572-BGA, FCBGA

572-FBGA, FC (25x25)

260

-40°C ~ 100°C (TJ)

Tray

Arria II GX

活跃

Wireless & RF Integrated Circuits

Si

0.87 V ~ 0.93 V

EP2AGX95

89178

6839296

3747

RF System on a Chip - SoC

N/A

-

活跃

表面贴装

Module

Kamaya Inc.

Tape & Reel (TR)

-40°C ~ 85°C

*

1.85V, 3.3V

2.4GHz, 5GHz

-

100Mbps

-

802.11a/b/g/n, Bluetooth v5.0

20dBm

Bluetooth, WiFi

Antenna Not Included, U.FL

-102dBm

SPI, UART, USB

30mA

260mA

-

N/A

-

N/A

-

Non-Compliant

N/A

-

Tray

活跃

卡边缘

Module

SIMCom Wireless Solutions Limited

150 V

-40°C ~ 85°C

-

0.25 %

100 ppm/°C

965 Ω

155 °C

-55 °C

Thin Film

250 mW

3V ~ 3.6V

850MHz, 900MHz, 1.8GHz, 1.9GHz

-

10Mbps

-

EDGE, GPRS, HSPA+, LTE, WCDMA

-

Cellular

不包括天线

-

I²C, PCM, UART, USB

-

-

-

650 µm

N/A

-

802.11 b/g/n

+ 85 C

3.6 V

- 40 C

500

802.11b

2.7 V

SMD/SMT

87 mA

SPI, UART

256 mA

Microchip

Microchip Technology / Atmel

Chip

802.11 b/g/n, Bluetooth

ATWINC3400

活跃

Chip

22.43 mm x 14.73 mm x 2 mm

多协议模块

Gold

Jam Nut

表面贴装

36-SMD Module

微芯片技术

Non-Compliant

-40°C ~ 85°C

Bulk

Crimp

介质访问控制网络控制器

125 °C

-55 °C

Male

Wireless & RF Modules

2.7V ~ 3.6V

Straight

49.63 mm

2.412 GHz to 2.472 GHz

55

Pin

10 Channel

Cadmium

256 kB

18.3 dBm

1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s

-

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Integrated, Chip

-95dBm

I²C, SPI, UART

23.7mA

24mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK

能源模块

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

多协议模块

55.16 mm

无

有

N/A

-

N/A

-

Multi-mode Smart LTE Module with Wi-Fi & Bluetooth

表面贴装

Commercial grade

LCC

-40 to 75 °C

Commercial

N/A

-

活跃

ADRF5301

Analog Devices Inc.

Box

-

Switch, SPDT

37GHz ~ 49GHz

Board(s)

N/A

-

活跃

SMD

400 Kbps

表面贴装

85C

SMD模块

3.3(V)

无

1.8(V)

-40C

-93dBm

0dBm

有

+ 85 C

3.3 V

- 40 C

500

3.3 V

4.9 mA

I2C, SPI, UART

4.9 mA

Panasonic

Panasonic

芯片天线

Details

Bluetooth Low Energy (BLE)

ENW-89

9.5 mm x 9 mm x 1.8 mm

Industrial grade

Bluetooth Modules - 802.15.1

表面贴装

28-SMD Module

PEI-Genesis

Bulk

-40 to 85 °C

卷带

*

蓝牙低功耗模块

Wireless & RF Modules

1.8V ~ 3.3V

2.4 GHz

28

274 V

4

128 kB

520 nA

-

-

PAN1740A

Bluetooth 5.0

Industrial

-

Bluetooth

Integrated, Chip

- 93 dBm

ADC, GPIO, I²C, I²S, PDM, SPI, UART

5.3mA

4.9mA

-

蓝牙模块

蓝牙模块

1.8 mm

9.5 mm

9 mm

N/A

-

Metal

活跃

Copper Alloy

Gold

Panel Mount, Through Hole

Flange

不锈钢

Glenair

零售包装

-65°C ~ 175°C

806

Solder

Receptacle, Female Sockets

Silver

Threaded

B

Passivated

44-1

Ground

N/A

-

RN73R1J

活跃

0603 (1608 Metric)

0603

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RN73R

0.063 L x 0.031 W (1.60mm x 0.80mm)

±1%

2

±50ppm/°C

759 Ohms

Thin Film

0.1W, 1/10W

-

Automotive AEC-Q200, Moisture Resistant

0.022 (0.55mm)

AEC-Q200

N/A

-

活跃

KYOCERA AVX

Bulk

*

N/A

-

活跃

Reliance North America

Tape & Box (TB)

*

N/A

-

S18LY

活跃

通孔

Module

Round

Banner Engineering Corporation

Bulk

-40°C ~ 85°C

S18L

LED

3.3V ~ 5V

700MHz, 800MHz, 850MHz, 900MHz, 1.7GHz, 1.8GHz, 1.9GHz, 2.1GHz

快速连接

-

10V ~ 30V

-

25mA

180°

圆形，带平顶

375kbps

16.00mm Dia

-

-

GNSS, GPS, LTE

-

-

-

-

Cellular, Navigation

Antenna Not Included, U.FL

Yellow

-

Serial

14mA

14mA

-

-

DC

N/A

-

活跃

PEI-Genesis

Bulk

*

N/A

-

RN73H2E

活跃

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RN73H

0.126 L x 0.098 W (3.20mm x 2.50mm)

±1%

2

±50ppm/°C

8.2 kOhms

Metal Film

0.25W, 1/4W

-

Automotive AEC-Q200, Moisture Resistant

0.028 (0.70mm)

AEC-Q200

N/A

-

L30960-N4010

Obsolete

表面贴装

Module

Telit Cinterion

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-40°C ~ 90°C

-

3.3V ~ 4.5V

800MHz, 850MHz, 900MHz, 2.1GHz

10MB Flash, 10MB RAM

7.2Mbps

-

GSM, HSDPA, HSUPA, LTE, UMTS, WCDMA

-

Cellular

不包括天线

-

ADC, GPIO, PWM, SPI, USB

-

-

-

N/A

-

活跃

表面贴装

18-SMD Module

Ai-Thinker

Strip

-40°C ~ 85°C

-

2.7V ~ 3.6V

2.4GHz

4MB Flash

72.2Mbps

BL602

802.11b/g/n, Bluetooth v5.0

19dBm

Bluetooth, WiFi

Antenna Not Included, I-PEX

-98dBm

GPIO, I²C, PWM, SDIO, SPI, UART

65mA

230mA ~ 260mA

-

N/A

-

Obsolete

表面贴装

Module

Telit Cinterion

Box

-40°C ~ 85°C

-

3.3V ~ 4.2V

800MHz, 850MHz, 900MHz, 1.8GHz, 1.9GHz, 2.1GHz

-

480Mbps

-

EDGE, GPRS, GSM, HSPA+, UMTS, WCDMA

-

Cellular

不包括天线

-158dBm

USB

-

-

-