类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | JESD-30代码 | 电源电压-最大值(Vsup) | 电源电压-最小值(Vsup) | 内存大小 | 数据率 | 使用的 IC/零件 | 议定书 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 消费者集成电路类型 | 敏感度 | 串行接口 | 接收电流 | 传输电流 | 调制 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |
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 | MTQ-LVW3-B02.R2-SP | Multi-Tech Systems Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 底座安装 | Module | -40°C~85°C | MultiTech Dragonfly™ | 活跃 | 1 (Unlimited) | 5V | 700MHz 850MHz 1.7GHz 1.9GHz | 10Mbps | 4G LTE CAT-1 (AT&T/T-Mobile) | Cellular | Antenna Not Included, U.FL | I2C, SPI, UART, USB | 37mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| MTSMC-LVW3-U.R2-SP | Multi-Tech Systems Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 通孔 | Module | -40°C~85°C | SocketModem® Cell | 活跃 | 1 (Unlimited) | 3.3V~5V | 700MHz 1.7GHz 1.9GHz | 10Mbps | 4G LTE CAT-1 (Verizon) | Cellular | Antenna Not Included, U.FL | UART, USB | 104mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| MTSMC-LVW3.R2-SP | Multi-Tech Systems Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 通孔 | Module | -40°C~85°C | SocketModem® Cell | 活跃 | 1 (Unlimited) | 3.3V~5V | 700MHz 1.7GHz 1.9GHz | 10Mbps | 4G LTE CAT-1 (Verizon) | Cellular | Antenna Not Included, U.FL | UART | 19mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| MM2-LV-T-U | FreeWave Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 底座安装 | Module | -40°C~85°C | MM2 | 活跃 | 不适用 | 3.5V | 902MHz~928MHz | 153.6kbps | General ISM < 1GHz | Integrated, Chip | -108dBm | 串行 TTL | 125mA | 1.175A | GFSK | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| GS1011MEE-SDK2-HW | Telit | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | -40°C~85°C | GS1011M | 活跃 | 1 (Unlimited) | 3.3V | 2.4GHz | 384kB Flash 128kB RAM | 11Mbps | 802.11b/g/n | 18dBm | WiFi | Antenna Not Included, U.FL | SPI, UART | CCK, DSSS | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| GS1500M-SDK2-HW-R2 | Telit | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | -40°C~85°C | GS1500M | 活跃 | 1 (Unlimited) | 3.3V | 2.4GHz | 384kB Flash 128kB RAM | 72.2Mbps | GS1011 | 802.11b/g/n | WiFi | PCB Trace | I2C, SPI, UART | CCK, DSSS, OFDM | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | JN5139-Z01-M/01R1V | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 2008 | JN5139-Z01-M0x | Obsolete | 1 (Unlimited) | 2.2V~3.6V | 2.4GHz | 192kB ROM 96kB RAM | Zigbee® | 2.5dBm | 802.15.4 | Antenna Not Included, SMA | -96dBm | I2C, SPI, UART | 37mA | 37mA | ROHS3 Compliant | |||||||||||||||||||||||||||
 | X09-009WNC | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | 0°C~70°C | Bulk | 2004 | XStream™ | Obsolete | 1 (Unlimited) | 5V | 900MHz | 9.4kbps | 20dBm | General ISM < 1GHz | Integrated, Wire Antenna | -110dBm | UART | 50mA | 140mA | FHSS | ||||||||||||||||||||||||||||
 | X09-019WNC | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | 0°C~70°C | Bulk | 2004 | XStream™ | Obsolete | 1 (Unlimited) | 5V | 900MHz | 18.8kbps | 20dBm | General ISM < 1GHz | Integrated, Wire Antenna | -107dBm | UART | 50mA | 140mA | FHSS | ||||||||||||||||||||||||||||
 | MICRF610Z TR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | -20°C~75°C | Tape & Reel (TR) | 2006 | RadioWire® | Obsolete | 2 (1 Year) | 2V~2.5V | 868MHz | 15kbps | 9dBm | General ISM < 1GHz | Integrated, Trace | -111dBm | 13.5mA | 28mA | FSK | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | JN5139-Z01-M/00R1T | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | 2008 | JN5139-Z01-M0x | Obsolete | 1 (Unlimited) | 2.2V~3.6V | 2.4GHz | 192kB ROM 96kB RAM | Zigbee® | 2.5dBm | 802.15.4 | Integrated, Trace | -96dBm | I2C, SPI, UART | 37mA | 37mA | ROHS3 Compliant | |||||||||||||||||||||||||||
| ISM43340-M4G-L44-10U-C6.2.1.8 | Inventek Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 54-SMD Module | -40°C~85°C | eS-WiFi™, WICED | 活跃 | 2A (4 Weeks) | 3V~3.6V | 2.4GHz 5GHz | 72Mbps | STM32F405 | 802.11a/b/g/n, Bluetooth v4.0 | 19dBm | Bluetooth, WiFi | Antenna Not Included, U.FL | -93dBm | ADC, GPIO, SPI, UART, USB | 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, GFSK, OFDM, QPSK | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | LARA-R204-02B-02 | U-Blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 28 Weeks | 表面贴装 | 100-SMD Module | YES | -40°C~85°C | Cut Tape (CT) | LARA-R2 | 活跃 | 4 (72 Hours) | 100 | 3.8V | UNSPECIFIED | 无铅 | 未说明 | 1 | 3.8V | 750MHz 1.7GHz | 未说明 | R-XXMA-N100 | 4G LTE CAT-1 (Verizon) | 射频和基带电路 | 33dBm | Cellular | Antenna Not Included, Castellation | -111.5dBm | I2C, I2S, UART, USB | 50mA~540mA | QPSK | 2.87mm | 26mm | 24mm | 符合RoHS标准 | |||||||||||||||
 | K-LC2 | RFbeam Microwave GmbH | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 通孔 | 5-SIP Module | -20°C~60°C | 活跃 | 1 (Unlimited) | 4.75V~5.25V | 24.05GHz~24.25GHz | 17dBm | -96dBm | FSK | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | GXM-T14 | FreeWave Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 底座安装 | Module | -40°C~85°C | GXM | 活跃 | 不适用 | 3.3V~5V | 2.4GHz~2.483GHz | 153.6kbps | General ISM > 1GHZ | Integrated, Chip | -105dBm | 串行 TTL | 165mA | 1.2A | GFSK | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| BM64SPKS1MC2-0002AA | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 43-SMD Module | YES | Automotive grade | -20°C~70°C | 活跃 | 1 (Unlimited) | 43 | ALSO AVAILABLE 5V SUPPLY-NOM FOR ADAPTER, SEATED HGT-NOM | 3.2V~4.2V | UNSPECIFIED | 无铅 | 1 | 1.2mm | 2.402GHz~2.48GHz | R-XXMA-N43 | 4.2V | 3.2V | 3Mbps | Bluetooth v5.0 | TS 16949 | 2dBm | Bluetooth | Integrated, Trace | 消费电路 | -90dBm | I2S, UART | 8DPSK, DQPSK, GFSK | 2.5mm | 32mm | 15mm | ROHS3 Compliant | ||||||||||||||
| WF111-N-V1 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.7V~3.6V | compliant | 2.4GHz | 72.2Mbps | 802.11b/g/n | 电信电路 | 17dBm | WiFi | -97dBm | PIO, SDIO, SPI | 70mA~88mA | 74mA~192mA | 符合RoHS标准 | |||||||||||||||||||||||||||
 | ISM43340-M4G-L44-10UF-C6.2.1.8 | Inventek Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 54-SMD Module | -40°C~85°C | Tray | eS-WiFi™, WICED | 活跃 | 4 (72 Hours) | 3V~3.6V | 2.4GHz 5GHz | 2MB Flash | 72Mbps | EFR32MG12 | 802.11a/b/g/n, Bluetooth v4.0 | 19dBm | Bluetooth, WiFi | Antenna Not Included, U.FL | -93dBm | SPI, UART | 38mA~90mA | 符合RoHS标准 | ||||||||||||||||||||||||||
 | SARA-U260-00S-02 | U-Blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | 96-SMD Module | YES | -40°C~85°C | Tape & Reel (TR) | SARA-U2 | 活跃 | 4 (72 Hours) | 96 | ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V | 3.3V~4.4V | BOTTOM | BUTT | 1 | 3.8V | 850MHz 1.9GHz | R-XBCC-B96 | 7.2Mbps | 3G (AT&T) | 射频和基带电路 | 24dBm | Cellular | 不包括天线 | -111dBm | GPIO, I2C, UART, USB | 595mA | 3.25mm | 26mm | 16mm | 符合RoHS标准 | ||||||||||||||||
 | HL8518_1103928 | Sierra Wireless | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 146-LGA Module | -40°C~85°C | Tape & Reel (TR) | HL | 活跃 | 3 (168 Hours) | 900MHz 1.8GHz | 7.2Mbps | EDGE, GPRS, GSM | Cellular | 不包括天线 | UART, USB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | ESP32-WROVER-B (M213DH6464PC3Q0) | Espressif Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | Module | -40°C~65°C | Tape & Reel (TR) | ESP | 活跃 | 3 (168 Hours) | 2.7V~3.6V | 2.4GHz~2.5GHz | 448kB ROM 536kB SRAM | 150Mbps | ESP32-D0WD | 802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3 | 20dBm | Bluetooth, WiFi | PCB Trace | -98dBm | ADC, GPIO, I2C, I2S, PWM, SDIO, SPI, UART | ROHS3 Compliant | |||||||||||||||||||||||||||
 | MM2-LV-T | FreeWave Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 2 Weeks | 底座安装 | Module | -40°C~85°C | MM2 | 活跃 | 不适用 | 3.5V | 902MHz~928MHz | 153.6kbps | General ISM < 1GHz | Integrated, Chip | -108dBm | 串行 TTL | 125mA | 1.175A | GFSK | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | BH661C-503 | Fanstel Corp. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 24-SMD Module | -40°C~85°C | Tape & Reel (TR) | 活跃 | 1 (Unlimited) | 1.8V~3.6V | 4.33Mbps | TC35661 | Bluetooth v4.2 | 2dBm | Bluetooth | Integrated, Chip | -91dBm | GPIO, I2C, SPI, UART | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | NINA-B111-02B-00 | U-Blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 30-SMD Module | -40°C~85°C | Tape & Reel (TR) | NINA-B1 | 活跃 | 4 (72 Hours) | 1.7V~3.6V | 2.4GHz | 512kB Flash 64kB RAM | 2Mbps | nRF52832 | Bluetooth v5.0 | 7dbm | Bluetooth | 不包括天线 | -95dBm | ADC, GPIO, I2C, I2S, SPI, UART | 5.4mA | 5.3mA | GFSK | 符合RoHS标准 | ||||||||||||||||||||||||
| NINA-B111-01B-00 | U-Blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 表面贴装 | 30-SMD Module | -40°C~85°C | Tape & Reel (TR) | NINA-B1 | 活跃 | 4 (72 Hours) | 1.7V~3.6V | 2.4GHz | 512kB Flash 64kB RAM | 2Mbps | nRF52832 | Bluetooth v5.0 | 7dbm | Bluetooth | 不包括天线 | -95dBm | ADC, GPIO, I2C, I2S, SPI, UART | 5.4mA | 5.3mA | GFSK | 符合RoHS标准 |