类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | 工作电源电压 | 界面 | 内存大小 | 内存大小 | 输出功率 | 数据率 | 使用的 IC/零件 | 议定书 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 敏感度 | 串行接口 | 接收电流 | 传输电流 | 调制 | 灵敏度(dBm) | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |
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 | ISP130301-BM-RS | Insight SIP | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | 57-SMD Module | -40°C~85°C | Tape & Reel (TR) | 活跃 | 5 (48 Hours) | 1.8V~3.6V | 2.4GHz | 256kB Flash 32kB RAM | 1.03Gbps | nRF51822 | Bluetooth v4.2 | 4dBm | Bluetooth | Integrated, Trace | -93dBm | ADC, I2C, SPI, UART | 10.5mA~16mA | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
 | AMW007-1.2.0R | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Module | -40°C~85°C | Cut Tape (CT) | Discontinued | 3 (168 Hours) | 3.3V | 2.4GHz | 802.11b/g/n | 20dBm | WiFi | -93dBm | SPI, UART | 65mA | 100mA~200mA | ||||||||||||||||||||||||||||||||||||||||
 | SPB800-BCP1 | H&D Wireless AB | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tray | 2010 | 活跃 | 1 (Unlimited) | 85°C | -40°C | 3V~3.6V | 2.4GHz | SPI, UART | 54Mbps | 802.11b/g | WiFi | Integrated, Chip | UART | 77mA | 186mA | 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, OFDM | Unknown | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | MTQ-C2-B02-N16-SP | Multi-Tech Systems Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 8 Weeks | 底座安装 | Module | -40°C~85°C | Bulk | 2014 | MultiConnect® Dragonfly™ | Obsolete | 1 (Unlimited) | 5V | 800MHz 1.9GHz | 512kB Flash 96kB SRAM | 2G 1xRTT | Cellular | Antenna Not Included, U.FL | I2C, SPI, UART, USB | 53mA | ||||||||||||||||||||||||||||||||||||||
 | XBP24-Z7CIT-005 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -40°C~85°C | Bulk | 2015 | XBee-Pro® ZB | Obsolete | 1 (Unlimited) | 85°C | -40°C | 3V~3.4V | 2.4GHz | UART | 250kbps | EM250 | Zigbee® | 17dBm | 802.15.4 | Integrated, Chip | -102dBm | UART | 45mA | 295mA | DSSS | -102 dBm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | MTSMC-C1-IP-N2 | Multi-Tech Systems Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -30°C~70°C | Tray | 2010 | SocketModem® | Obsolete | 1 (Unlimited) | 70°C | -30°C | 5V | 800MHz 1.9GHz | 5V | UART | 1.2W | 153.6kbps | CDMA | Cellular | Antenna Not Included, U.FL | -161dBm | UART | 560mA | 560mA | -161 dBm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | TEL0073 | DFRobot | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 4 Weeks | 表面贴装 | Module | -40°C~85°C | Bulk | 2015 | Bluno Bee | 活跃 | 1 (Unlimited) | 3.3V | 2.4GHz | 1Mbps | CC2540 | Bluetooth v4.0 | Bluetooth | -93dBm | USB | 8.7mA | 11mA | GFSK | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| CC-WMX-L76C-TE-1 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | Module | -40°C~85°C | Bulk | 2016 | ConnectCore® 6 | Discontinued | 1 (Unlimited) | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| XBP24-BPIT-003J | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -40°C~85°C | Bulk | 2013 | XBee-Pro® ZNet 2.5 | Obsolete | 1 (Unlimited) | 3V~3.4V | 2.4GHz | 250kbps | Zigbee® | 10dBm | 802.15.4 | Integrated, Trace | UART | 45mA | 295mA | DSSS | -102 dBm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | DC-WEM-02T-NC | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7.6MB | 表面贴装 | 表面贴装 | Module | -30°C~85°C | Bulk | 2005 | Digi Connect® Wi-EM | Obsolete | 1 (Unlimited) | 85°C | -30°C | 3.3V | 2.4GHz | 3.3V | Ethernet, SPI, Serial | 4MB Flash 8MB RAM | 11Mbps | 802.11b | 16dBm | WiFi | Antenna Not Included, RP-SMA | -92dBm | SPI | 400mA | 400mA | CCK, DBPSK, DQPSK | -92 dBm | 49.1mm | 47.1mm | 19.9mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
 | CC-9U-T724-Z1 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | Module | -20°C~70°C | 2008 | ConnectCore® 9U | 不用于新设计 | 1 (Unlimited) | 3.14V~3.45V | 180MHz | 30V | UART | 32MB Flash 32MB SDRAM | 12Mbps | AT91RM9200 | General ISM < 1GHz | SPI, UART, USB | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||
| XBP24-BUIT-001J | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -40°C~85°C | Bulk | 2013 | XBee-Pro® ZNet 2.5 | Obsolete | 1 (Unlimited) | 3V~3.4V | 2.4GHz | 250kbps | Zigbee® | 10dBm | 802.15.4 | Antenna Not Included, U.FL | UART | 45mA | 295mA | DSSS | -102 dBm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| XBP24-Z7WIT-002J | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -40°C~85°C | Bulk | XBee-Pro® ZB | Obsolete | 1 (Unlimited) | 85°C | -40°C | 3V~3.4V | 2.4GHz | UART | 250kbps | EM250 | Zigbee® | 10dBm | 802.15.4 | Integrated, Wire Antenna | -102dBm | UART | 45mA | 170mA | DSSS | -102 dBm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| XBP24-Z7WIT-002 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -40°C~85°C | Bulk | XBee-Pro® ZB | Obsolete | 1 (Unlimited) | 85°C | -40°C | 3V~3.4V | 2.4GHz | UART | 250kbps | EM250 | Zigbee® | 17dBm | 802.15.4 | Integrated, Wire Antenna | -102dBm | UART | 45mA | 295mA | DSSS | -102 dBm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | 317060016 | Seeed Technology Co., Ltd | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 9 Weeks | 通孔 | Module | 28.349523g | -20°C~100°C | Bulk | 2014 | 活跃 | 1 (Unlimited) | 3.3V | 2.4GHz~2.48GHz | 1MB Flash | 72.2Mbps | ESP8266 | 802.11b/g/n | 15dBm | WiFi | Integrated, Trace | -98dBm | UART | 62mA | 215mA | 6.35mm | 82.55mm | 57.15mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | WT41-A-AI5 | Silicon Labs | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | Module | 59 | -40°C~85°C | Cut Tape (CT) | 2010 | Obsolete | 3 (168 Hours) | 59 | 8542.39.00.01 | 3V~3.6V | UNSPECIFIED | 1 | 3.3V | 1.5mm | 2.4GHz | 3.3V | GPIO, SPI, UART, USB | 3Mbps | BlueCore4 | Bluetooth v2.1 + EDR, Class 1 | 电信电路 | 19dBm | Bluetooth | Integrated, Chip | PIO, SPI, UART, USB | 52.6mA | 51.6mA~120mA | -92 dBm | 5.65mm | 35.3mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||
| CC-9U-T724-Z1-B | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 通孔 | Module | -20°C~70°C | 2017 | ConnectCore® 9U | Discontinued | 1 (Unlimited) | 3.14V~3.45V | 180MHz | 32MB Flash 32MB SDRAM | 12Mbps | AT91RM9200 | General ISM < 1GHz | SPI, UART, USB | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||
 | LTP5902IPC-IPMA#PBF | Linear Technology/Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | -40°C~85°C | Tray | 2013 | SmartMesh® IP | 活跃 | 3 (168 Hours) | 2.1V~3.76V | 2.4GHz | LTP5902 | 66 | 512kB Flash 72kB SRAM | 250kbps | Smartmesh IP™, 6LoWPAN | 8dBm | 802.15.4 | Antenna Not Included, MMCX | -95dBm | SPI, UART | 4.5mA | 5.4mA~9.7mA | DSSS | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | XM1205C915XE1 | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | Bulk | 2004 | TrueRF™ | Obsolete | 1 (Unlimited) | 2.4V | 915MHz | XM1205 | SPI | 152.3kbps | XE1205 | 15dBm | General ISM < 1GHz | Antenna Not Included, RP-SMA | -121dBm | SPI | 14mA | 62mA | FSK | -121 dBm | 30mm | 55mm | Non-RoHS Compliant | 无铅 | ||||||||||||||||||||||||||||
 | ENW-F9201A1EF | Panasonic Electronic Components | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | 51-SMD Module | Industrial grade | -30°C~85°C | Tape & Reel (TR) | PAN9026 | 活跃 | 3 (168 Hours) | 1.8V~3.3V | 2.4GHz 5GHz | 150Mbps | 88W8977, PAN9026 | 802.11a/b/g/n, Bluetooth v5.0 | 电信电路 | 16dBm | Bluetooth, WiFi | Integrated, Chip | -98dBm | SDIO, JTAG, PCM, UART | 70mA | 400mA | CCK, DSSS, OFDM | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | XBP09-DPSIT-156 | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 通孔 | 通孔 | Module | -40°C~85°C | Bulk | 2009 | XBee-PRO® 900 | Obsolete | 1 (Unlimited) | 3V~3.6V | 900MHz | 3.6V | 156kbps | ADF7023 | 17dBm | General ISM < 1GHz | Antenna Not Included, RP-SMA | UART | 80mA | 210mA | FHSS | -100 dBm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||
 | XT09-MI | Digi | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 底座安装 | Module | -40°C~85°C | Bulk | 2006 | XTend® | Obsolete | 1 (Unlimited) | 2.8V~5.5V | 900MHz | 225kbps | 30dBm | General ISM < 1GHz | Antenna Not Included, MMCX | -110dBm | UART | 80mA | 90mA~730mA | FHSS, FSK | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | LTP5901IPC-IPMA#PBF | Linear Technology/Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 16 Weeks | 表面贴装 | Module | -40°C~85°C | Tray | 2013 | SmartMesh® IP | 活跃 | 3 (168 Hours) | 2.1V~3.76V | 2.4GHz | LTP5901 | 66 | 512kB Flash 72kB SRAM | 250kbps | Smartmesh IP™, 6LoWPAN | 8dBm | 802.15.4 | Integrated, Chip | -95dBm | SPI, UART | 4.5mA | 5.4mA~9.7mA | DSSS | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | BMD-350-A-R | U-Blox | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | Module | -40°C~85°C | Tape & Reel (TR) | BMD-300 | 活跃 | 3 (168 Hours) | 1.7V~3.6V | unknown | 2.4GHz | 512kB Flash 64kB RAM | 2Mbps | nRF52832 | Bluetooth v5.0 | 电信电路 | 4dBm | Bluetooth | Integrated, Trace | -96dBm | I2C, I2S, SPI, UART | 5.4mA~11.7mA | 5.3mA~16.6mA | GFSK | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | HUM-868-DT | Linx Technologies Inc. | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 6 Weeks | 表面贴装 | 表面贴装 | Module | -40°C~85°C | Tray | HumDT™ | yes | 活跃 | 1 (Unlimited) | 2V~3.6V | 868MHz | 115.2kbps | Proprietary | 9.5dBm | General ISM < 1GHz | Antenna Not Included, Castellation | UART | 22mA | 20.5mA~38mA | FHSS, MSK | -101 dBm | 符合RoHS标准 |