类别是'射频收发器模块'
射频收发器模块 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 安装类型 | 包装/外壳 | 表面安装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 类型 | 子类别 | 电压 - 供电 | 端子位置 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | 终端样式 | JESD-30代码 | 工作频率 | 工作电源电压 | 工作电压 | 极性 | 温度等级 | 通道数量 | 界面 | 内存大小 | 工作电源电流 | 内存大小 | 程序存储器类型 | 程序内存大小 | 输出功率 | 箝位电压 | 数据率 | 数据总线宽度 | 座位高度-最大 | 使用的 IC/零件 | 产品类别 | 议定书 | 频率范围 | 筛选水平 | 通信IC类型 | 功率 - 输出 | 无线电频率系列/标准 | 天线类型 | 敏感度 | 串行接口 | 接收电流 | 传输电流 | 调制 | 闪光大小 | 产品 | 调制技术 | 产品类别 | 设备核心 | 高度 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | ESP32-H2-MINI-1U-N4 | Espressif Systems | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 61-SMD Module | Espressif Systems | -40°C ~ 85°C (TA) | Tape & Reel (TR) | ESP | 活跃 | 3V ~ 3.6V | 2.4GHz | 4MB Flash | 2Mbps | Bluetooth v5.3, Zigbee® | 18.5dBm | 802.15.4, Bluetooth | 不包括天线 | -105.5dBm | GPIO, I2C, I2S, JTAG, PWM, SPI, UART, USB | 25mA ~ 29mA | 26mA ~ 123mA | O-QPSK | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-022001-00 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Bluetooth Low Energy (BLE) | I2C, SPI, UART | - 87 dBm | 1.8 V | - 40 C | + 85 C | 有 | 500 | 0.000705 oz | LGA | 表面贴装 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBLE-022001 | 活跃 | 10 x 10 x 1.8mm | 3dBm | 4.5 V | 21-SMD Module | Infineon Technologies | Details | -40°C ~ 85°C | MouseReel | EZ-BLE™ PRoC™ | 1.8V ~ 4.5V | 2.4 GHz | 21 | 1.8 V to 4.5 V | 128kB Flash, 16kB SRAM | 3 dBm | 1 Mb/s | - | Bluetooth 4.1 | 3dBm | Bluetooth | Integrated, Chip | -91dBm | I²C, SPI, UART | 16.4mA | 15.6mA | - | 1.8mm | 10mm | 10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-012011-00 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Bluetooth Low Energy (BLE) | I2C, I2S, SPI, UART | - 87 dBm | 1.71 V | - 40 C | + 85 C | 有 | SMD/SMT | 500 | 16.4 mA | 15.6 mA | 0.000705 oz | 1 Mbps | 表面贴装 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBLE-012011 | 活跃 | 5.5 V | 31-SMD Module | Infineon Technologies | Details | -40°C ~ 85°C | MouseReel | EZ-BLE™ PRoC™ | 1.8V ~ 5.5V | 2.4 GHz | 35 | 1.71 V to 5.5 V | 128kB Flash, 16kB SRAM | 3 dBm | 1 Mb/s | - | Bluetooth 5.1 | 3dBm | Bluetooth | Integrated, Trace | - 87 dBm | I²C, SPI, UART | 16.4mA | 15.6mA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-202007-01 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Bluetooth Low Energy (BLE) | I2C, SPI, UART | - 93 dBm | 1.71 V | - 40 C | + 85 C | External w/U.FL Connector | U.FL | 有 | SMD/SMT | 500 | 16.4 mA | 15.6 mA | EZ-BLE | 0.244124 oz | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBLE-202007 | 活跃 | 5.5 V | 30-SMD Module | Infineon Technologies | Details | -40°C ~ 85°C | 切割胶带 | PRoC™ BLE | 1.8V ~ 4.5V | 2.4 GHz | 1.71 V to 5.5 V | 256kB Flash, 32kB SRAM | 7.5 dBm | 1 Mb/s | - | Bluetooth 4.2 | 7.5dBm | Bluetooth | Integrated, Trace | - 93 dBm | I²C, SPI, UART | 16.4mA | 27mA | - | GFSK | 2 mm | 23 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBT-343026-01 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Class 1, Class 2 | I2C, SPI, UART | - 93.5 dBm | 2.3 V | - 30 C | + 85 C | Trace | SMA | 有 | SMD/SMT | 500 | 26.4 mA | 52.5 mA | EZ-BT | 0.105213 oz | SMD模块 | 3 Mbps | Class I/Class II | 表面贴装 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBT-343026 | 活跃 | 3.6 V | 12 mm x 15.5 mm x 1.95 mm | SMT-24 | 微电子组件 | UNSPECIFIED | -30 °C | 未说明 | 85 °C | 有 | CYBT-343026-01 | RECTANGULAR | 活跃 | CYPRESS SEMICONDUCTOR - CYBT-343026-01 - BLE MODULE, V5.0/EDR, 2.402-2.48GHZ | CYPRESS SEMICONDUCTOR CORP | 1.64 | 24-SMD Module | YES | 24 | Infineon Technologies | Details | -30 to 85 °C | MouseReel | EZ-BT™ WICED® | Bluetooth 5.0 Module | 2.3V ~ 3.6V | UNSPECIFIED | 无铅 | Shielded | 未说明 | 1 | 1.22 mm | compliant | 2.44 GHz | 24 | R-XXMA-N24 | 2.4 to 2.48 GHz | 2.3 V to 3.6 V | OTHER | 1 | 512 kB | 9 dBm | 3 Mb/s | 1.95 mm | - | Bluetooth 5.0 | 2402 MHz to 2480 MHz | 电信电路 | 12dBm | Bluetooth | Integrated, Trace | - 93.5 dBm | I²C, I²S, PCM, SPI, UART | 26.4mA | 60.3mA | 8DPSK, DQPSK, GFSK | 4-DQPSK, 8-DPSK, GFSK | 1.95 mm | 12 mm | 15.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-013025-00 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Bluetooth Low Energy (BLE), Class 2 | I2C, SPI, UART | - 94 dBm | 2.3 V | - 30 C | + 85 C | Trace | SMA | 有 | SMD/SMT | 500 | 22 mA | 26 mA | EZ-BLE | 0.071694 oz | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBLE-013025 | 活跃 | 3.63 V | 14.52 mm x 19.2 mm x 2.25 mm | 31-SMD Module | Infineon Technologies | Details | -30°C ~ 85°C (TA) | MouseReel | EZ-BLE™ PRoC™ | 2.3V ~ 3.6V | Shielded | 2.44 GHz | 2.3 V to 3.63 V | 128 kB, 60 kB | 4 dBm | 1 Mb/s | - | Bluetooth 4.1 | 2402 MHz to 2480 MHz | 4dBm | Bluetooth | Integrated, Trace | - 94 dBm | I²C, SPI, UART | 26mA | 22mA | GFSK | GFSK | 2.25 mm | 14.52 mm | 19.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-416045-02 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Bluetooth Low Energy (BLE) | I2C, SPI, UART | - 93 dBm | 1.71 V | - 40 C | + 85 C | PCB | 有 | SMD/SMT | 500 | 6.7 mA | 5.7 mA | EZ-BLE | 0.532240 oz | SMD | 2 Mbps | 二级 | Host PCB | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBLE-416045 | 活跃 | 3.6 V | 14 mm x 18.5 mm x 2 mm | Industrial grade | 288 KB | 43-SMD Module | Infineon Technologies | Details | -40 to 85 °C | MouseReel | EZ-BLE™ PSoC® | USB适配器 | 1.71V ~ 3.6V | Shielded | 2.44 GHz | 43 | 2400 to 2482 MHz | 1.71 V to 3.6 V | 32 | Serial I2C/Serial I2S/SPI/UART/USB | 13.2 mA | 128 kB, 288 kB, 1 MB | 4 dBm | - | - | Bluetooth 5.0 | 2400 MHz to 2482 MHz | Industrial | 4dBm | Bluetooth | Integrated, Trace | - 93 dBm | I²S, SPI, UART | 6.7mA | 5.7mA | GFSK | 1024 KB | 蓝牙模块 | 2 mm | 18.5 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBT-353027-02 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Bluetooth Low Energy (BLE), Class 1, Class 2 | I2C, SPI, UART | - 93.5 dBm, - 96.5 dBm | 2.3 V | - 30 C | + 85 C | 有 | SMD/SMT | 500 | 26.4 mA | 52.5 mA | EZ-BT | 0.166140 oz | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBT-353027 | 活跃 | 3.6 V | 9 mm x 9 mm x 1.75 mm | 19-SMD Module | Infineon Technologies | Details | -30°C ~ 85°C (TA) | 切割胶带 | EZ-BT™ WICED® | USB适配器 | 2.3V ~ 3.6V | 2.44 GHz | 2.3 V to 3.6 V | 352 kB, 512 kB | 12 dBm | - | - | Bluetooth 5.0 | 2.402 GHz to 2.48 GHz | 12dBm | Bluetooth | Integrated, Trace | - 93.5 dBm, - 96.5 dBm | I²C, I²S, PCM, SPI, UART | 26.4mA | 60.3mA | 8DPSK, DQPSK, GFSK | 1.75 mm | 9 mm | 9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-212023-10 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Bluetooth Low Energy (BLE) | I2C, I2S, SPI, UART | - 91 dBm | 1.8 V | - 40 C | + 85 C | Integrated | 有 | SMD/SMT | 500 | 16.4 mA | 15.6 mA | EZ-BLE | 0.025026 oz | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Obsolete | 5.5 V | 31-SMD Module | Infineon Technologies | Details | -40°C ~ 85°C | 切割胶带 | EZ-BLE™ PRoC™ | 1.8V ~ 4.5V | 2.45 GHz | 1.8 V to 5.5 V | 256kB Flash, 32kB SRAM | 3 dBm | 1 Mb/s | - | Bluetooth 4.1 | 2.4 GHz to 2.5 GHz | 3dBm | Bluetooth | Integrated, Trace | - 91 dBm | I²C, SPI, UART | 16.4mA | 15.6mA | - | 0.75 mm | 19.2 mm | 14.52 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBT-343151-02 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | SMD/SMT | 500 | 26.4 mA | 52.5 mA | EZ-BT | Details | Bluetooth Low Energy (BLE), Class 1, Class 2 | Ethernet, I2C, I2S, SPI, UART | - 89.5 dBm, - 96.5 dBm | 2.3 V | - 30 C | + 85 C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBT-343151 | 活跃 | 12 x 15.5 x 1.95mm | 9 dBm, 12dBm | 3.6 V | 24-SMD Module | Infineon Technologies | 有 | -30°C ~ 85°C (TA) | 切割胶带 | EZ-BT™ WICED | USB适配器 | 2.3V ~ 3.6V | Shielded | 2.44 GHz | 2.3 V to 3.6 V | 512 kB | 12 dBm | 4 Mb/s | - | Bluetooth 5.0 | 2402 MHz to 2480 MHz | 12dBm | Bluetooth | Integrated, Trace | - 89.5 dBm, - 96.5 dBm | I²C, I²S, PCM, SPI, UART | 26.4mA | 60.3mA | 8DPSK, DQPSK, GFSK | 蓝牙模块 | 1.95 mm | 15.5 mm | 12 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBT-333032-02 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 26.4 mA | 500 | SMD/SMT | 有 | 射频焊盘 | External | + 85 C | - 30 C | 2.3 V | - 96.5 dBm | I2C, I2S, PCM, SPI, UART | Class 1, Class 2 | Details | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBT-333032 | 活跃 | 3.6 V | 12 mm x 13.5 mm x 1.95 mm | 24-SMD Module | Infineon Technologies | 52.5 mA | -30°C ~ 85°C (TA) | 切割胶带 | EZ-BT™ WICED® | 2.3V ~ 3.6V | 2.44 GHz | 2.3 V to 3.6 V | 512 kB, 352 kB | 9 dBm | 4 Mb/s | - | Bluetooth 5.0 | 2402 MHz to 2480 MHz | 12dBm | Bluetooth | 不包括天线 | - 96.5 dBm | ADC, I²C, I²S, PCM, PWM, SPI, UART | 26.4mA | 52.5mA ~ 60.3mA | 8DPSK, DQPSK, GFSK | 蓝牙模块 | 1.95 mm | 13.5 mm | 12 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBT-333047-02 | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Class 1, Class 2 | I2C, I2S, PCM, SPI, UART | - 96.5 dBm | 2.3 V | - 30 C | + 85 C | External | u.FL | 有 | SMD/SMT | 500 | 26.4 mA | 52.5 mA | 0.035687 oz | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | CYBT-333047 | 活跃 | 3.6 V | 12 mm x 13.5 mm x 1.95 mm | 24-SMD Module | Infineon Technologies | Details | -30°C ~ 85°C (TA) | 切割胶带 | EZ-BT™ WICED® | 2.3V ~ 3.6V | 2.44 GHz | 2.3 V to 3.6 V | 512 kB, 352 kB | 9 dBm | 4 Mb/s | - | Bluetooth 5.0 | 2402 MHz to 2480 MHz | 12dBm | Bluetooth | Antenna Not Included, U.FL | - 96.5 dBm | ADC, I²C, I²S, PCM, PWM, SPI, UART | 26.4mA | 52.5mA ~ 60.3mA | 8DPSK, DQPSK, GFSK | 蓝牙模块 | 1.95 mm | 13.5 mm | 12 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NCH-RSL10-101WC51-ABG | RSL10 SOC | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3A991f. | 8542.39.00.01 | 无 | 无 | Bluetooth v5.2 (BLE) | Microprocessor | 2 | 2400 | 2483.5 | ISM | -97 | I2C/JTAG/PCM/SPI/UART | 1.18 | 1.25 | 3.3 | 30u(Typ) | -40 | 85 | IoT | 表面贴装 | 0.95(Max) | 6 | 6 | 48 | QFN | QFN EP | No Lead | Compliant | 卷带 | 活跃 | Chip | 48 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NCH-RSL10-101Q48-ABG | RSL10 SOC | ON Semiconductor | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | EAR99 | 8542.39.00.01 | 无 | 无 | Bluetooth v5.2 (BLE) | Microprocessor | 2 | 2400 | 2483.5 | ISM | -97 | I2C/JTAG/PCM/SPI/UART | 1.18 | 1.25 | 3.3 | 30u(Typ) | -40 | 85 | IoT | 表面贴装 | 0.95(Max) | 6 | 6 | 48 | QFN | QFN EP | No Lead | Compliant | 卷带 | 活跃 | Chip | 48 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ADRV9003BBCZ-RL | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Cooper | EVAL-ADRV9003 | 96 kbps | + 110 C | 1.89 V | - 40 C | 1500 | 0.975 V | SMD/SMT | SPI | ADRV9003BBCZ | 模拟器件 | Details | Tape & Reel (TR) | 活跃 | 12 mm x 12 mm x 1.17 mm | 射频收发器 | BGA-196 | Analog Devices Inc. | A200056-3-COH | -40°C ~ 85°C | Reel | - | 窄带 | Wireless & RF Integrated Circuits | 1V, 1.3V, 1.8V | 30MHz ~ 6GHz | - | - | ADRV9003 | - | 30 MHz to 6 GHz | 7.8dBm | General ISM > 1GHz | 不包括天线 | - | GPIO, SPI | - | - | - | 射频收发器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-224116-01 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | SMD | 1 Mbps | 二级 | 表面贴装 | CYBLE-224116 | 活跃 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 15.4 x 9.5 x 1.8mm | +105 °C | -40 °C | -95dBm | 9.5dBm | Integrated | 3.6 V | 2 V | SMD/SMT | 20 mA | I2C, SPI, UART | 16.4 mA | Bluetooth Low Energy (BLE) | 32-SMD Module | Infineon Technologies | FEP | -40 to 105 °C | EZ-BLE™ PSoC® | Creator XT/XR BT 4.2 Module | Wireless & RF Modules | 2V ~ 3.6V | Shielded | 2.4GHz | 32 | 2402 to 2480 MHz | 3.3, 4.2 V | 1 | 33 mA | 256kB Flash, 32kB SRAM | 9.5 dBm | 8Mbps | - | Bluetooth v4.2 | 2.4 GHz to 2.5 GHz | 扩展工业 | 9.5dBm | Bluetooth | Integrated, Chip | -95dBm | I²C, SPI, UART | 21.5mA | 20mA | - | 蓝牙模块 | 蓝牙模块 | 1.8mm | 15.4mm | 9.5mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBT-423054-02 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | CYBT-423054 | 活跃 | 500 | Infineon | Infineon Technologies | Details | Bluetooth Modules - 802.15.1 | Infineon Technologies | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Reel | - | Wireless & RF Modules | 蓝牙模块 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | OC2321VQFN8XTMA1 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Bulk | PEI-Genesis | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STM32WB5MMGH6TR | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | LGA 86L | MSL 3 - 168 hours | - | 0.009630 oz | 1800 | STM32WB5MMGH6 | STMicroelectronics | STMicroelectronics | STM32 | Details | 有 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | STM32 | 活跃 | Chip | 7.3 mm x 11 mm x 1.34 mm | + 85 C | 3.6 V | - 40 C | 1.7 V | I2C, USART, USB | 多协议模块 | 86-LFLGA Module | STMicroelectronics | STM32WB | -40°C ~ 85°C (TA) | MouseReel | STM32WB | Wireless & RF Modules | 1.71V ~ 3.6V | 2.4GHz | 86 | I2C, LPUART, SAI, SPI, USART, USB | 1MB Flash, 256kB SRAM | Flash | 1 MB | 6 dBm | 2Mbps | 32bit | STM32WB55VGY | Bluetooth v5.0, Thread, Zigbee® | 6dBm | 802.15.4, Bluetooth | Integrated, Chip | -100dBm | ADC, I²C, SPI, UART, USART, USB | - | - | - | 多协议模块 | ARM Cortex M0+, ARM Cortex M4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-222005-00 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 7000-08221-2511000 | Obsolete | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Module | Infineon Technologies | Murrelektronik | -40°C ~ 85°C | EZ-BLE™ PRoC™ | 1.8V ~ 5.5V | 2.4GHz | 256kB Flash, 32kB SRAM | 1Mbps | - | Bluetooth v4.1 | 3dBm | Bluetooth | Integrated, Chip | -91dBm | I²C, SPI, UART | 16.4mA | 15.6mA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYWM6934 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 0.039577 oz | - 55 C | 1250 | 11 A | 1.5 kW | Panjit | Panjit | Details | 30 kV | 95 V | + 175 C | Bulk | Obsolete | ESD Suppressors / TVS Diodes | DO-201-2 | Infineon Technologies | 30 kV | - | Reel | - | TVS Diodes / ESD Suppression Diodes | Axial | 85.5 V | 双向 | 1 Channel | 137 V | - | TVS 二极管 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ADRV9003BBCZ | Analog Devices | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Glenair | SPI | ADRV9003BBCZ-RL | Details | 有 | EVAL-ADRV9003 | 96 kbps | + 110 C | 1.89 V | - 40 C | 1 | 0.975 V | SMD/SMT | 活跃 | Tray | 12 mm x 12 mm x 1.17 mm | 军规圆形连接器 | BGA-196 | Analog Devices Inc. | Glenair | -40°C ~ 85°C | Tray | ADRV9003 | 窄带 | Circular Connectors | 1V, 1.3V, 1.8V | 30MHz ~ 6GHz | - | - | ADRV9003 | - | 30 MHz to 6 GHz | 7.8dBm | General ISM > 1GHz | 不包括天线 | - | GPIO, SPI | - | - | - | 军规圆形连接器 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBT-483039-02 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | Obsolete | 18.59 x 12.75 x 1.8mm | +85 °C | -30 °C | -95dBm | 20dBm | 34-SMD Module | Infineon Technologies | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -30°C ~ 85°C | EZ-BT™ XR WICED® | 1.76V ~ 3.63V | 2.402GHz ~ 2.48GHz | 1MB Flash, 512kB SRAM | 3Mbps | CYW20719 | Bluetooth v5.0 +EDR | 20dBm | Bluetooth | Integrated, Chip | -95dBm | ADC, I²C, I²S, PCM, PWM, SPI, UART | 5.9mA | 5.6mA | 8DPSK, DQPSK, GFSK | 1.8mm | 18.59mm | 12.75mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYWM6935 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Obsolete | Module | Infineon Technologies | Bulk | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYBLE-333074-02 | Infineon | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 活跃 | SMD/SMT | 18 mA | I2C, UART | - 94.5 dBm | 8 mA | Class 2 | U.FL | 21.89 mm x 13.31 mm x 1.95 mm | + 85 C | 3.6 V | - 30 C | 2.5 V | 43-SMD Module | Infineon Technologies | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | -30°C ~ 85°C | AIROC™ Bluetooth® | USB适配器 | Wireless & RF Modules | 2.5V ~ 3.6V | Shielded | 2.4GHz | 2.5 V to 3.6 V | 512kB Flash, 384kB RAM | 12 dBm | 6Mbps | CYW20835 | Bluetooth v5.2 | 2.402 GHz to 2.48 GHz | 12dBm | Bluetooth | Antenna Not Included, U.FL | -94.5dBm | ADC, I²C, PWM, SPI, UART | 8mA | 18mA | GFSK | 蓝牙模块 | 蓝牙模块 | 1.95 mm | 21.89 mm | 13.31 mm |