N/A

-

XB3

活跃

U.FL

24.38 mm x 32.94 mm

+ 85 C

4.3 V

- 40 C

3.3 V

I2C, SPI, UART

表面贴装

Module

Digi

Bag

-40°C ~ 85°C

XBee® 3 Cellular

3.3V ~ 4.3V

-

1MB Flash, 64kB RAM

1Mbps

23dBm

Bluetooth, Cellular, Navigation

Integrated, Chip + U.FL

-113dBm

I²C, JTAG, SPI, UART, USB

-

-

N/A

-

RN73R2A

活跃

表面贴装

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-55°C ~ 155°C

RN73R

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.05%

2

±10ppm/°C

4.53 kOhms

Thin Film

0.125W, 1/8W

3V ~ 3.6V

-

-

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

18dBm

Bluetooth

不包括天线

-96.5dBm

AIO, GPIO, SPI, UART, USB

44mA

85mA ~ 136mA

-

Automotive AEC-Q200, Moisture Resistant

0.024 (0.60mm)

AEC-Q200

N/A

-

表面贴装

表面贴装

TO-236-3, SC-59, SOT-23-3

16

SOT-23-3

Compliant

-40°C ~ 85°C (TA)

Tape & Reel (TR)

--

活跃

Simple Reset/Power-On Reset

75 °C

-20 °C

11.5 mm

870 MHz

ISL88002

开路漏极或开路集电极

2.5 V

2 V

低电平有效

15 kbps

1.67V

1

140 ms Minimum

13.6 mA

26 mA

-111 dBm

14.1 mm

无SVHC

N/A

-

64000 Kbps

Industrial grade

LGA

-40 to 85 °C

Industrial

N/A

-

N/A

-

Box

MTSMC-MNA1

活跃

80.01 mm x 34.925 mm

+ 85 C

5 VDC

- 40 C

3.3 V

Serial, USB

通孔

64-DIP Module, 45 Leads

Multi-Tech Systems Inc.

Non-Compliant

-40°C ~ 85°C

SocketModem® Cell

Female

3.3V ~ 5V

700MHz, 1.7GHz, 1.9GHz

Pin

-

375kbps

-

4G LTE CAT- M1 (AT&T/Verizon-Mobile), GNSS

-

Cellular, Navigation

Antenna Not Included, U.FL

-

Serial

14mA

14mA

-

Modems

N/A

-

N/A

-

MultiTech

MultiTech

Bulk

活跃

Modems

底座安装

Module

Multi-Tech Systems Inc.

1

-40°C ~ 85°C

MultiTech Dragonfly™

Ethernet & Communication Modules

3.3V ~ 5V

700MHz, 800MHz, 850MHz, 900MHz, 1.7GHz, 1.8GHz, 1.9GHz, 2.1GHz, 2.3GHz, 2.5GHz, 2.6GHz

-

150Mbps

-

4G LTE CAT-4 (AT&T/Verizon), HSPA+

-

Cellular

不包括天线

-

UART, USB

-

-

-

Modems

N/A

-

N/A

-

Gold

通孔

24

Polyamide (PA46), Nylon 4/6, Glass Filled

铍铜

Brass

--

--

105°C

Correct-A-Chip® 354W00

活跃

--

Solder

3A

0.100 (2.54mm)

Tin-Lead

0.050 (1.27mm)

DIP, 0.3 (7.62mm) Row Spacing

SOWIC

--

10.0µin (0.25µm)

200.0µin (5.08µm)

UL94 V-0

N/A

-

最后一次购买

79lm (61lm ~ 97lm)

表面贴装

1108 (2720 Metric)

1108

OSRAM Opto (ams OSRAM)

Tape & Reel (TR)

-40°C ~ 85°C

SYNIOS® P2720

0.108 L x 0.079 W (2.75mm x 2.00mm)

Red

2.8V ~ 3.6V

2.4GHz

-

2.225V

120°

350mA

54Mbps

101 lm/W

-

500mA

802.11b/g

618nm (612nm ~ 624nm)

18dBm

WiFi

Integrated, Trace

-95dBm

SPI

156mA

226mA ~ 237mA

DSSS, OFDM

0.028 (0.70mm)

N/A

-

活跃

PEI-Genesis

Bulk

*

N/A

-

活跃

PEI-Genesis

Bulk

*

N/A

-

Metal

活跃

Copper Alloy

Gold

Panel Mount, Through Hole

Flange

Aluminum

Glenair

零售包装

-65°C ~ 175°C

806

Solder

Receptacle, Female Sockets

Silver

Threaded

A

化学镍

N/A

-

Non-Compliant

50.8 mm

N/A

-

3.3 V

3 V

11000@b/54000@g/65000@n Kbps

3.6 V

Industrial grade

LGA

-40 to 85 °C

44

14

Industrial

DBPSK/DQPSK/CCK/BPSK/QPSK/16QAM/64QAM

N/A

-

Socket Mount

0 to 80 °C

Dual Band Wireless-AC Wi-Fi 802.11a/c and Bluetooth 4.2 Module

2.4/5 GHz

N/A

-

最后一次购买

Quectel

Tape & Reel (TR)

-

N/A

-

Box

MTSMC-MNA1

活跃

通孔

Module

Multi-Tech Systems Inc.

Non-Compliant

-40°C ~ 85°C

SocketModem® Cell

3.3V ~ 5V

700MHz, 1.7GHz, 1.9GHz

-

375kbps

-

4G LTE CAT-1 (AT&T/T-Mobile)

-

Cellular

Antenna Not Included, U.FL

-

Serial

14mA

14mA

-

N/A

-

N/A

-

10V

290W (Tc)

SSRC

0.070548 oz

5000

Heyco

Heyco

HEYClip

Details

Screws & Fasteners

通孔

ISOPLUS247™

ISOPLUS247™

13A (Tc)

-55°C ~ 150°C (TJ)

Tube

HiPerFET™, PolarP2™

活跃

Hardware

MOSFET (Metal Oxide)

N-Channel

630 mOhm @ 10A, 10V

6.5V @ 1mA

11100pF @ 25V

193nC @ 10V

1200V

±30V

--

Screws & Fasteners

N/A

-

活跃

Integrated

WiFi

有

+ 85 C

3.3 V

0.701423 oz

- 40 C

490

3.3 V

GPIO, JTAG, I2C, I2S, QSPI, SDIO, SPI, UART, USB

Silicon Laboratories

Silicon Labs

n-Link

Details

802.11 a/b/g/n, Bluetooth, ZigBee

多协议模块

Glenair

零售包装

Tray

*

Wireless & RF Modules

2.4 GHz

3.3 V

15 dBm, 17 dBm, 18 dBm, 19 dBm

250 kb/s, 3 Mb/s, 11 Mb/s, 54 Mb/s, 150 Mb/s

802.11b (CCK, DSSS), 802.15.4-2009 (DSSS), Bluetooth (GFSK, DQPSK, 8DPSK), OFDM (16-QAM, 64-QAM, BPSK, QFSK)

多协议模块

N/A

-

有

+ 105 C

100

Silicon Laboratories

Silicon Labs

Details

Strip

MGM220

活跃

Built-in

15 mm x 12.9 mm

3.8 V

- 40 C

1.8 V

Bluetooth, GPIO, I2C, UART

Zigbee Modules - 802.15.4

表面贴装

31-SMD Module

Silicon Labs

--

-40°C ~ 105°C

切割胶带

*

活跃

Wireless & RF Modules

1.8V ~ 3.8V

2.4 GHz

512kB Flash, 32kB RAM

8 dBm

2Mbps

EFR32MG22

Bluetooth v5.2, Zigbee®

8.2dBm

802.15.4, Bluetooth

Integrated, Chip

-106.7dBm

I²C, I²S, SPI, UART, USART

4.3mA ~ 4.4mA

4.8mA ~ 10.6mA

DSSS, GFSK, OOK, O-QPSK

Zigbee Modules

N/A

-

16 (20), 20 (23)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

NINA-B112

活跃

面板安装

30-SMD Module

Bulkhead - Front Side Nut

Circular

铝合金

Plastic

u-blox

--

-65°C ~ 175°C

Bulk

Military, MIL-DTL-83723 Series III

活跃

--

插座外壳

用于公引脚

43

卡口锁

Crimp

1.7V ~ 3.6V

6

Unshielded

抗环境干扰

2.4GHz

Cadmium

24-43

橄榄色

不包括触点

512kB Flash, 64kB RAM

--

2Mbps

nRF52832

Bluetooth v5.0

--

6dBm

Bluetooth

Integrated, Chip

-95dBm

ADC, GPIO, I²C, I²S, SPI, UART

5.4mA

5.3mA

GFSK

--

--

N/A

-