N/A

-

3.3 V

- 40 C

+ 85 C

u.FL

1

3.6 V

50.85 mm x 29.9 mm x 6.2 mm

USB

3.3 V to 3.6 V

N/A

-

I2C, SPI, UART

1.8 V

- 40 C

+ 125 C

Class 2

有

PCB 安装

- 93.9 dBm

100

蓝壁虎

3.8 V

PCB

12.5 mm x 15.5 mm x 2.25 mm

Details

切割胶带

MGM210L

Shielded

2.4 GHz

1.8 V to 3.8 V

12.5 dBm

2 Mb/s

Bluetooth 5.1

蓝牙模块

N/A

-

Class 2

I2C, SPI, UART

- 97 dBm

1.8 V

- 40 C

+ 125 C

有

SMD/SMT

100

Mighty Gecko

3.8 V

15.5 mm x 22.5 mm

Details

切割胶带

MGM210L

Shielded

2.4 GHz

1.8 V to 3.8 V

12.5 dBm

1 Mb/s

Bluetooth 5.1

蓝牙模块

GFSK

N/A

-

2.5 m

3.3 V

UART

+ 85 C

- 40 C

通孔

1

0.892167 oz

5 V

25.4 mm x 43.2 mm x 9.1 mm

31 s

3.3 V to 5 V

99 Channel

45 mA

N/A

-

NFC

1

NFC-READER-WINDSCREEN

2.575940 oz

Bulk

活跃

Lantronix, Inc.

Details

Bulk

*

N/A

-

0 C

+ 80 C

WiFi

有

802.11 ax, Bluetooth 5.2

WPA, WPA2, WPA3

1000

Wi-Fi 6

999ADP

0.003527 oz

12 mm x 16 mm x 1.65 mm

PCIe, USB

Details

Wi-Fi 6 AX200

2.4 GHz, 5 GHz

2.4 Gb/s

N/A

-

802.11 ac

PCIe, USB

0 C

+ 80 C

WiFi

1000

Wireless-AC

984180

Details

Wireless-AC 9260

2.4 GHz, 5 GHz

1.73 Gb/s

N/A

-

卡边缘

I2C, UART, USB

- 35 C

+ 75 C

有

250

3.3 V

无线通信模块

0.163318 oz

表面贴装

3.3 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

EC21

活跃

Pad

32 mm x 29 mm x 2.4 mm

Industrial grade

Module

Quectel

Details

-40 to 85 °C

切割胶带

-

LTE Cat 1 Module

3V ~ 3.6V

-

3.3 V

-

33 dBm

10 Mbps

-

GSM, LTE, WCDMA

850, 900, 1800, 1900 MHz

Industrial

33dBm

Cellular

不包括天线

-102.5/-110.5/-109 dBm

UART, USB

34mA

34mA

-

N/A

-

卡边缘

ADC, I2C, SDIO, SGMII, UART, USB

- 35 C

+ 75 C

有

250

3.8 V

无线通信模块

0.163318 oz

LCC

表面贴装

3.8 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

EC25

最后一次购买

Patch

-

32 mm x 29 mm x 2.4 mm

-

Module

Quectel

Details

-40 to 85 °C

切割胶带

-

LTE Cat 4 Module

3V ~ 3.6V

1.561GHz, 1.575GHz, 1.602GHz

3.8 V

-

33 dBm

480Mbps

-

LTE, WCDMA

1900/1700/850/2600/700/1700 MHz

Extended

33dBm

Cellular

不包括天线

-

I²C, PCM, UART, USB

-

-

8PSK, 16QAM, 64QAM, GMSK

N/A

-

表面贴装

GPIO, I2C, UART, USB

3.3 V

- 30 C

+ 75 C

有

250

无线通信模块

0.141096 oz

表面贴装

3.3 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

BG95

活跃

23.6 mm x 19.9 mm x 2.2 mm

Module

Quectel

Details

-40 to 85 °C

切割胶带

-

LTE Cat M1/Cat NB2/EGPRS Module

-

-

3.3 V

-

21 dBm

1.2 Mbps

-

-

600/700/800/850/900/1700/1800/1900/2100 MHz

-

-

-

-

-

-

-

-

N/A

-

表面贴装

35 s

- 148 dBm

3.3 V

I2C, UART

+ 85 C

- 40 C

有

SMD/SMT

250

无线通信模块

0.032452 oz

3.3 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

L26

最后一次购买

16 mm x 12.2 mm x 2.3 mm

24-SMD Module

Quectel

Details

-40°C ~ 85°C

切割胶带

-

2.7V ~ 2.9V

1561.098 MHz, 1575.42 MHz, 1602.5625 MHz

3.3 V

-

921.6kbps

-

BeiDou, Galileo, GLONASS, GPS, GNSS

-

Navigation

不包括天线

-165dBm

I²C, UART

-

-

-

N/A

-

I2C, PCM, UART, USB

34 mA

34 mA

- 40 C

+ 80 C

100

3 V

无线通信模块

0.368613 oz

3.6 V

Pad

32 mm x 29 mm x 2.4 mm

Details

Tray

LTE模块

-

33 dBm

N/A

-

表面贴装

802.11 b/g/n

GPIO, I2C, I2S, SPI, UART, USB

3 V

160 mA, 200 mA, 220 mA, 310 mA

63 mA, 68 mA

- 40 C

+ 85 C

IPEX

有

WiFi

650

3.6 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

ESP32-S2

活跃

15.4 mm x 15.4 mm x 2.4 mm

65-SMD Module

Espressif Systems

Details

-40°C ~ 85°C

Tray

ESP32

3V ~ 3.6V

2.412 GHz to 2.484 GHz

3 V to 3.6 V

128kB ROM, 320kB SRAM

15 dBm, 19.5 dBm

150 Mb/s

ESP32-S2

802.11b/g/n

19.5dBm

WiFi

不包括天线

-97dBm

ADC, GPIO, I²C, I²S, SPI, PWM, UART, USB

63mA ~ 68mA

160mA ~ 310mA

-

N/A

-

表面贴装

Serial

2.7 V

- 40 C

+ 65 C

WiFi

有

802.11 b/g/n, Bluetooth

650

0.168175 oz

Tape & Reel (TR)

ESP32

活跃

3.6 V

38-SMD Module

Espressif Systems

Details

-40°C ~ 85°C (TA)

ESP32-WROVER

2.7V ~ 3.6V

2.4 GHz to 2.5 GHz

2.7 V to 3.6 V

448kB ROM, 536kB SRAM

18.5 dBm

150 Mb/s

ESP32-D0WD

802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3

20dBm

Bluetooth, WiFi

PCB Trace

-98dBm

ADC, GPIO, I²C, I²S, PWM, SDIO, SPI, UART

-

-

-

N/A

-

3 V

- 40 C

+ 85 C

802.11 a/b/g/n, Bluetooth 4.0, Zigbee

WPA/WPA2, WPS

3.6 V

14 mm x 15 mm x 2.1 mm

SPI, UART, USB

2.4 GHz

3 V to 3.6 V

17 dBm

54 Mb/s

16-QAM, 64-QAM, OFDM, QPSK

N/A

-

3 V

- 40 C

+ 85 C

Integrated, u.FL

802.11 a/b/g/n, Zigbee

WPA/WPA2, WPS

3.6 V

SPI, UART, USB

2.4 GHz, 5 GHz

3 V to 3.6 V

17 dBm

54 Mb/s

16-QAM, 64-QAM, OFDM, QPSK

N/A

-

SPI, UART, USB

3 V

- 40 C

+ 85 C

WPA/WPA2, WPS

3.6 V

802.11 a/b/g/n

2.4 GHz

3 V to 3.6 V

17 dBm

54 Mb/s

16-QAM, 64-QAM, OFDM, QPSK

N/A

-

SPI, UART, USB

3 V

- 40 C

+ 85 C

U.FL

WPA/WPA2, WPS

3.6 V

Bulk

Obsolete

Silicon Labs

802.11 a/b/g/n

-

2.4 GHz to 5.8 GHz

3.3 V

17 dBm

54 Mb/s

16-QAM, 64-QAM, OFDM, QPSK

N/A

-

GPIO, SPI

1.62 V

45 mA

55 mA

- 40 C

+ 85 C

有

500

DWM3000

3.6 V

24 mm x 13 mm x 2.9 mm

Details

切割胶带

DWM3000

6.5 GHz, 8 GHz

1.62 V to 3.6 V, 2.5 V to 3.6 V

可编程

Integrated

射频收发器

N/A

-

表面贴装

UART, USB

3.3 V

- 40 C

+ 85 C

802.11 ac

有

802.11 a/b/g/n/ac, Bluetooth 5.2

250

0.024339 oz

17 x 12 x 2.13mm

3.3 V

Strip

活跃

External

68-SMD Module

Laird Connectivity Inc.

Details

-40°C ~ 85°C (TA)

切割胶带

Sterling LWB5+

3.2V ~ 4.8V

3.6V dc

2.4 GHz, 5 GHz

3.3 V

-

433.3Mbps

CYW4373EUBGT

802.11a/b/g/n/ac, Bluetooth v5.0

18dBm

Bluetooth, WiFi

不包括天线

-96dBm

GPIO, HCI, PCM, SDIO, SPI, UART, USB

-

-

16QAM, 64QAM, 256QAM, 4DPSK, BPSK, CCK, DSSS, DQPSK, GFSK, OFDM, QPSK

N/A

-

表面贴装

UART, USB

3.3 V

- 40 C

+ 85 C

802.11 ac

有

802.11 a/b/g/n/ac, Bluetooth 5.2

1000

0.024339 oz

3.3 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

12 mm x 17 mm x 2.2 mm

Module

Laird Connectivity Inc.

Details

-40°C ~ 85°C

Reel

Sterling LWB5+

3.3V

2.4 GHz, 5 GHz

3.3 V

-

433.3Mbps

-

802.11ac, Bluetooth v5.0

18dBm

Bluetooth, WiFi

Integrated, Trace

-

SDIO, UART

-

-

256QAM

N/A

-

表面贴装

802.11 b/g/n

SPI

1.62 V

145 mA

42.3 mA

- 40 C

+ 105 C

Integrated

有

WiFi

260

3.6 V

Tray

WFM200

活跃

6.5 mm x 6.5 mm

58-SMD Module

Silicon Labs

Details

-40°C ~ 105°C (TA)

Tray

-

1.62V ~ 3.6V

2.412 GHz to 2.484 GHz

1.8 V, 3.3 V

-

15.1 dBm

72.2 Mb/s

WFM200S

802.11b/g/n

15.1dBm

WiFi

Integrated, Chip

-96.3dBm

SDIO, SPI

42.3mA ~ 48.3mA

45.4mA ~ 99.4mA

DSSS

N/A

-

-

2.1 V

17 mA

- 40 C

+ 85 C

PCB/U.FL

I2C, SPI, UART

有

36

3.6 V

Tray

XB3-24

活跃

0.866 in x 1.33 in x 0.120 in

300 ft, 2 mile

135 mA

-

Digi

Details

-

Tray

-

-

2.4 GHz

2.1 V to 3.6 V

-

19 dBm

-

-

-

-

-

PCB Trace

-

-

-

-

-

N/A

-

3.4 V

660 mA

660 mA

- 20 C

+ 65 C

150

Multi-mode LTE Cat 4 Modules

4.35 V

GPIO, I2C, I2S, SDIO, UART, USB

2100 MHz

3.4 V to 4.35 V

25 dBm

Multi Mode LTE Cat 4 Modules

N/A

-

表面贴装

802.11 b/g/n

GPIO, I2C, I2S, PWM, SPI, UART, USB OTG 1.1

3 V

160 mA, 200 mA, 220 mA, 310 mA

63 mA, 68 mA

- 40 C

+ 85 C

有

650

Tape & Reel (TR)

ESP32-S2

活跃

3.6 V

56-VFQFN Exposed Pad

Espressif Systems

Details

-40°C ~ 105°C (TA)

Tray

ESP32

2.8V ~ 3.6V

2.412 GHz to 2.484 GHz

128kB ROM, 320kB SRAM

13 dBm, 15 dBm, 19.5 dBm

150 Mb/s

ESP32-S2

802.11b/g/n

19.5dBm

WiFi

Antenna Not Included, U.FL

-97dBm

ADC, GPIO, I²C, I²S, PWM, SPI, UART, USB

63mA ~ 68mA

160mA ~ 310mA

-