类别是'接口 - 专用'
接口 - 专用 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 端口的数量 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 消费者集成电路类型 | 总线兼容性 | 最大数据传输率 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | |||
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.png) | 89H64H16AG2ZCBLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 1156 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 不合格 | 1.1V | 12.5/3.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 6275mA | I2C; ISA; VGA; SMBUS | 64000 MBps | 2.82mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 无铅 | ||||||||||||||||
| TSI382A-66CQY | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | TQFP | 176 | 70°C | 2004 | e3 | yes | 活跃 | 3 (168 Hours) | 176 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 260 | 1.2V | 0.4mm | 176 | 1.26V | COMMERCIAL | 1.14V | PCI | ISA; SBUS; VGA | 312.5 MBps | 1.4mm | 20mm | 20mm | 1.4mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | 89HPES12N3A1ZCBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 324 | 1999 | e1 | yes | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.5mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||
 | 89H32NT24AG2ZCHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | 250 | 30 | 484 | 3.3V | PCI Express | 24 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
 | 89HP0508PZBABG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | 2011 | yes | 活跃 | 100 | PCI Express | 消费电路 | 9mm | 9mm | 1.7mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||
 | 89HP0504UZBNRGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Tin | 表面贴装 | QFN | 36 | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | EAR99 | 8542.39.00.01 | 36 | PCI Express | 4mm | 7.5mm | 900μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
 | 89HP0508PZBAB8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 100 | 2011 | no | 活跃 | 100 | PCI Express | 消费电路 | 9mm | 9mm | 1.7mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||||
 | 89HP0504UBZBNRG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 36 | 70°C | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | 36 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5mm | 未说明 | 36 | 1.26V | COMMERCIAL | 1.14V | PCI Express | 消费电路 | 0.9mm | 4mm | 7.5mm | 900μm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
 | 89HP0504PZBNRGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | 表面贴装 | QFN | 36 | 85°C | Tape & Reel (TR) | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | 36 | EAR99 | Matte Tin (Sn) | ALSO AVAILABLE 3.3V SUPPLY-NOM FOR I2C | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5mm | 未说明 | 36 | 1.26V | INDUSTRIAL | 1.14V | PCI Express | 消费电路 | 0.9mm | 4mm | 7.5mm | 900μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||
 | 89H24NT24G2ZCHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 324 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; PCI; SMBUS; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | ||||||||||||||||
 | 89HP0504PZBABI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | Lead, Tin | 表面贴装 | 100 | 85°C | 2011 | e0 | no | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Lead (Sn63Pb37) | ALSO AVAILABLE 3.3V SUPPLY-NOM FOR I2C | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 | 0.8mm | not_compliant | 未说明 | 100 | 1.26V | INDUSTRIAL | 1.14V | PCI Express | 消费电路 | 9mm | 9mm | 1.7mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||
 | 89HP0504PZBNRG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | QFN | 36 | 70°C | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | 36 | EAR99 | Matte Tin (Sn) | ALSO AVAILABLE 3.3V SUPPLY-NOM FOR I2C | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5mm | 未说明 | 36 | 1.26V | COMMERCIAL | 1.14V | PCI Express | 消费电路 | 0.9mm | 4mm | 7.5mm | 900μm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | 89HP0504PZBNRGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | -40°C | 表面贴装 | QFN | 36 | 85°C | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | 36 | EAR99 | Matte Tin (Sn) | ALSO AVAILABLE 3.3V SUPPLY-NOM FOR I2C | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5mm | 未说明 | 36 | 1.26V | INDUSTRIAL | 1.14V | PCI Express | 消费电路 | 0.9mm | 4mm | 7.5mm | 900μm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
 | 89HP0504PZBABG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 100 | Tape & Reel (TR) | 2011 | e1 | yes | 活跃 | 3 (168 Hours) | 100 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO AVAILABLE 3.3V SUPPLY-NOM FOR I2C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 0.8mm | 未说明 | 100 | 1.26V | COMMERCIAL | 1.14V | PCI Express | 消费电路 | 9mm | 9mm | 1.7mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
 | 89HP0504PBZBNRGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 36 | 2011 | e3 | yes | 活跃 | 3 (168 Hours) | 36 | EAR99 | 哑光锡 | 85°C | -40°C | 8542.39.00.01 | QUAD | 无铅 | 260 | 1 | 0.5mm | 30 | 36 | 1.26V | INDUSTRIAL | 1.14V | PCI Express | 消费电路 | 0.9mm | 4mm | 7.5mm | 900μm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
 | 89H12NT12G2ZCHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | 260 | 30 | 324 | 3.3V | PCI Express | 12 | BUS CONTROLLER, PCI | 96 Gbps | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
| CA91L8260B-100CEV | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 7 Weeks | Copper, Silver, Tin | 表面贴装 | 420 | 2003 | e1 | yes | 活跃 | 3 (168 Hours) | 420 | 3A001.A.3 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.5V | 1.27mm | 未说明 | 420 | 不合格 | 2.63V | INDUSTRIAL | 2.38V | PCI | 100MHz | MPC825X; MPC826X; MPC827X; MPC8280; MPC74X; MPC75X; POWERPC 7400; POWERPC 740; POWERPC 750 | 2.46mm | 35mm | 35mm | 2.33mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||
 | 89HPES5T5ZBBCI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 196 | 125MHz | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 196 | EAR99 | Tin/Lead (Sn63Pb37) | 85°C | -40°C | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 196 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 5 | BUS CONTROLLER, PCI | PCI; SMBUS | 1.4mm | 15mm | 15mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||
 | 89H12NT12G2ZBHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | 260 | 30 | 324 | 3.3V | PCI Express | 12 | BUS CONTROLLER, PCI | 96 Gbps | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
 | 89HPES10T4G2ZABCG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | 表面贴装 | 324 | Tape & Reel (TR) | 1999 | yes | 活跃 | EAR99 | 8542.39.00.01 | 324 | PCI Express | 1.4mm | 19mm | 19mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||
 | 89H32NT24BG2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 2009 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||
 | 89H32NT24BG2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 2009 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||
 | 89H32NT8AG2ZBHLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 225 | not_compliant | 20 | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
 | 89H32NT24AG2ZBHLG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | Tape & Reel (TR) | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | 8542.39.00.01 | 250 | 30 | 484 | 3.3V | PCI Express | 24 | BUS CONTROLLER, PCI | 256 Gbps | 2.92mm | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
 | 89H16NT16G2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Copper, Silver, Tin | 表面贴装 | FCBGA | 324 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 未说明 | 324 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 16 | BUS CONTROLLER, PCI | 3300mA | 128 Gbps | I2C; ISA; VGA | 2.88mm | 19mm | 19mm | 3.02mm | 符合RoHS标准 | 无铅 |