类别是'振荡器'
振荡器 (6000)
图片 | 产品型号 | 品牌 | 数据表 | 有效性 | 单价(CNY) | 询价 | 认证 | 工厂交货时间 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终端 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | 电压 - 供电 | 电源电压 | 深度 | 频率 | 频率稳定性 | 输出量 | 终端样式 | 功能 | 基本谐振器 | 最大电流源 | 物理尺寸 | 工作频率 | 工作电源电压 | 上升时间-最大值 | 最大下降时间 | 对称性-最大值 | 电源电压-最大值(Vsup) | 电流 - 电源（禁用）（最大值） | 最大电源电压 | 最小电源电压 | 负载电容 | 最大电源电流 | 频率容差 | 线性 | 最大工作周期 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | 评级结果 | |||||||||
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 | ASFL1-20.000MHZ-EC-T | Abracon LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | 4 | Commercial grade | -20°C~70°C | Tape & Reel (TR) | ASFL1 | 0.197Lx0.126W 5.00mmx3.20mm | 活跃 | 1 (Unlimited) | XO (Standard) | 70°C | -20°C | 3.3V | 3.2mm | 20MHz | ±50ppm | HCMOS, TTL | Enable/Disable | Crystal | 15mA | 3.3V | 10μA | 3.63V | 2.97V | 15pF | 15mA | 0.01% | 1.2954mm | 0.051 1.30mm | 5mm | 3.2004mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
 | DSC6003CI2A-008.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Tube | DSC60XX | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V~3.3V | 8MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 3.2mm x 2.5mm x 0.85mm | 8MHz | 3.5ns | 3.5ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||
 | DSC1018DI1-028.6363T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1018 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR, 7/13 INCH | 1.8V | 28.6363MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.85mm | 28.6363MHz | 1.8V | 2ns | 2ns | 55/45% | 1.95V | 1μA | 15pF | 3mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||
| DSC1030DI1-042.5000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1030, PureSilicon™ | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; TR, 7/13 INCH | 3V | 3V | 42.5MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 4mA Typ | 2.5mm x 2.0mm x 0.85mm | 42.5MHz | 2ns | 2ns | 55/45% | 1μA | 4mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | DSC1103CE2-156.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -20°C~70°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | 2.25V~3.63V | 156.25MHz | ±25ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 156.25MHz | 52/48% | 95μA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||
| DSC1103CI5-233.3333T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | 2.25V~3.63V | 233.3333MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 233.3333MHz | 52/48% | 95μA | 2pF | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||
| DSC1103CI5-156.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | 2.25V~3.63V | 156.25MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.85mm | 156.25MHz | 52/48% | 95μA | 2pF | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||
 | DSC1121BM2-016.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 16MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 16MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||
| DSC1121CM1-030.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 30MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 30MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||
 | DSC1121AM1-050.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead Exposed Pad | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.6V | 50MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||
| DSC1121CM1-050.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | Standard, Surface Mount | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 50MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.9mm | 50MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||
| DSC1121BM1-060.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -55°C~125°C | Tape & Reel (TR) | DSC1121 | 0.197Lx0.126W 5.00mmx3.20mm | e3 | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 60MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 5.0mm x 3.2mm x 0.85mm | 60MHz | 2ns | 2ns | 55/45% | 22mA | 15pF | 35mA | 55 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||
| DSC1123AI1-150.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | 6 | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | Solder | XO (Standard) | 2.25V~3.63V | 150MHz | ±50ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 150MHz | 52/48% | 22mA | 2pF | 32mA | 52 % | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||
| DSC1123CI2-333.3300T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.126Lx0.098W 3.20mmx2.50mm | e4 | 活跃 | 1 (Unlimited) | XO (Standard) | Nickel/Palladium/Gold (Ni/Pd/Au) | 2.25V~3.63V | 333.33MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 3.2mm x 2.5mm x 0.85mm | 333.33MHz | 0.2ns | 0.2ns | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
| DSC1101CI1-025.0000T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 4-SMD, No Lead | -40°C~85°C | Tape & Reel (TR) | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | STANDBY; ENABLE/DISABLE FUNCTION; TR | 2.25V~3.6V | 25MHz | ±50ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 25MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| DSC1123AI5-322.2656T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 322.2656MHz | ±10ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.9mm | 322.2656MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| DSC1101CI2-014.7456 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1101 | 0.126Lx0.098W 3.20mmx2.50mm | e3 | yes | 活跃 | 3 (168 Hours) | XO (Standard) | Matte Tin (Sn) | 2.25V~3.6V | 14.7456MHz | ±25ppm | CMOS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 14.7456MHz | 2ns | 2ns | 55/45% | 95μA | 35mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| DSC1103AI2-171.8181T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead Exposed Pad | -40°C~85°C | Tape & Reel (TR) | DSC1103 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | STANDBY; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR | 2.25V~3.63V | 171.8181MHz | ±25ppm | LVDS | Standby (Power Down) | MEMS | 7.0mm x 5.0mm x 0.9mm | 171.8181MHz | 52/48% | 95μA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | |||||||||||||||||||||||||||||||||||||
| DSC1103CI5-075.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1103 | 0.126Lx0.098W 3.20mmx2.50mm | yes | 活跃 | 3 (168 Hours) | XO (Standard) | 2.25V~3.63V | 75MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 3.2mm x 2.5mm x 0.9mm | 75MHz | 52/48% | 95μA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||
| DSC6001CI1A-016.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Tube | DSC60XX | 0.126Lx0.098W 3.20mmx2.50mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V~3.3V | 16MHz | ±50ppm | CMOS | Enable/Disable | MEMS | 1.3mA Typ | 3.2mm x 2.5mm x 0.85mm | 16MHz | 2ns | 2ns | 55/45% | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||
 | DSC6101JI2A-030.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 12 Weeks | 表面贴装 | 4-SMD, No Lead | YES | -40°C~85°C | Bag | DSC61XX | 0.098Lx0.079W 2.50mmx2.00mm | 活跃 | 1 (Unlimited) | XO (Standard) | 1.8V~3.3V | 30MHz | ±25ppm | CMOS | Enable/Disable | MEMS | 3mA Typ | 2.5mm x 2.0mm x 0.89mm | 30MHz | 2.2ns | 2.2ns | 55/45% | 0.035 0.89mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||
 | ASG2-P-V-B-698.812334MHZ | Abracon LLC | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 15 Weeks | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 13.012431mg | -40°C~85°C | Bulk | ASG2-P | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 1 (Unlimited) | SMD/SMT | VCXO | 2.5V | 2.5V | 698.812334MHz | ±35ppm | LVPECL | Enable/Disable | Crystal | 2.5mm x 2.0mm x 1.0mm | 698.812334MHz | 2.5V | 0.6ns | 0.6ns | 55/45% | 65mA | 15% | 55 % | 990.6μm | 0.039 1.00mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | DSC1122DI2-156.2500T | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | 6 | -40°C~85°C | Tape & Reel (TR) | DSC1122 | 0.098Lx0.079W 2.50mmx2.00mm | yes | 活跃 | 3 (168 Hours) | SMD/SMT | XO (Standard) | 2.25V~3.6V | 156.25MHz | ±25ppm | LVPECL | Enable/Disable | MEMS | 2.5mm x 2.0mm x 0.85mm | 156.25MHz | 52/48% | 22mA | 0F | 58mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | DSC1123NI2-150.0000 | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 表面贴装 | 表面贴装 | 6-SMD, No Lead | -40°C~85°C | Tube | DSC1123 | 0.276Lx0.197W 7.00mmx5.00mm | yes | 活跃 | 1 (Unlimited) | XO (Standard) | 2.25V~3.63V | 150MHz | ±25ppm | LVDS | Enable/Disable | MEMS | 7.0mm x 5.0mm x 0.85mm | 150MHz | 52/48% | 22mA | 32mA | 889μm | 0.035 0.90mm | ROHS3 Compliant | AEC-Q100 | ||||||||||||||||||||||||||||||||||||||
 | SIT8102AC-43-33E-66.00000T | SiTime | 数据表 | N/A | - | 最小起订量: 1 倍率: 1 | 3.3 V | - 20 C | + 70 C | SMD/SMT | 3000 | 0.006562 oz | 3.3 V | QFN-4 | Details | Reel | SiT8102 | SMD/SMT | 70 °C | -20 °C | 66 MHz | 50 PPM | SMD/SMT | 3.3 V | 3.63 V | 2.97 V | 15 pF | 55 % | 0.85 mm | 7 mm | 5 mm |